Archive | Others

Tegal 90xe AW-90xeR Main Customers

1 Alliance
2 Anritsu Company
3 Beijing Yandong
4 Changzhou Chemsemi Co., Ltd
5 ClassOne Equipment Inc
6 CS Microelectronics Co., Ltd.
7 Duet Microelectronics Beijing Co.,Ltd.
8 DYNEX
9 Excelitas
10 Honeywell Sensing and Control
11 Jiangyin Xinshun
12 Micralyne
13 Microsemi Power Products Group
14 National Research Council Canada
15 NEDI
16 nuvoTon
17 OCLARO Technology Ltd.
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Rapid Thermal Processor’s Main Customers

1 13 Institute
2 44 Institute
3 Academy of Sciences of the Czech Republic
4 Accelink Technologies Co.,Ltd
5 ADS Inc./ Army Research Lab
6 Advanced Engineering Research Organization
7 Advanced Micro Semiconductors Co., Ltd
8 Advanced Packing Technology 
9 Advanced Semiconductor Manufacturing 
10 AdvanceTEC/ City College of NY
11 Advantest 
12 AERO
13 AET Co.,LTD
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Sputtering Equipment Main Customers

1 A-Flex Technologies Co., Ltd
2 Amphenol/GE
3 Anritsu Company
4 APT Electronics Ltd/ Nanjing TSL
5 BAE Systems
6 Bicmos Foundary
7 EnaChip Inc.
8 glo-usa Inc /Avicena Tech
9 Google LLC
10 Hangzhou Liangdongxin Microelectronics CO.Ltd
11 Hatchip Co.,/Hunan
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AW-105R Main Customers

1 3SP Technologies S.A.S
2 CETE 13 Institute
3 Changzhou Chemsemi Co., Ltd
4 Continental Automotive Systems Division
5 CS Microelectronics Co., Ltd.
6 Duet Microelectronics Beijing Co.,Ltd.
7 Dynax Semiconductor Inc.
8 Electronics Scientific Engineering Ltd
9 EPISTAR
10 Excelitas
11 Finisar
13 Hatchip Co.,/Hunan
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AW-B3000 Main Customers

1 Applied Materials
2 Archcom
3 Bridgelux, Inc.
4 Broadcom
5 Chengdu University of Electronic Science/Sichuan HuaLong
6 Chengdu Yaguang Electronics CO.,Ltd.
7 Chongqing University
8 Cree
9 Emcore Copration
10 Excelitas
11 Facebook Technologies, LLC
12 GE Global Research
13 General Research/Union Semicon/SUMEC
14 glo-usa Inc /Avicena Tech
15 Hong Kong University of Science & Technology
16 Infinera Corporation
17 JDSU
18 Keysight Technologies
19 Meridian Innovation Limited
20 Micralyne
21 On Semicondcutor
22 Ori-Chip Optoelectronics Technology
23 Quantum Devices, Inc.
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AccuThermo AW 610M Spare Parts Price List

The prices below are subject to change without notice.

Item

P/N

Description

Unit Price

Qty

Amount

Spare Kit, Level 1

1

2451-0010-02

Lamp, 1200W 208V

$52.00

5

$260.00

2

2504-0070

O-Ring, Purge Inlet

$3.00

2

$6.00

3

2504-0160-AW1

O-Ring, Flange to Tube,Door to Flange

$15.00

4

$60.00

4

5101-0030

Fuse,1A 250V,Fst-Blo

$2.00

2

$4.00

5

5101-0090

Fuse,1/2A 250V,Fst-Blo

$2.00

2

$4.00

6

A5-0346

Fuse,10A 250V

$5.00

2

$10.00

Subtotal

 

Spare Kit, Level 2

7

2109-0050

Lampholder,Tung Halg,10A 600V

$30.00

2

$60.00

8

A5-0391

Valve Solenoid NC-2 way 3/8″     

$200.00

2

$400.00

9

A5-0138

BELLOWS VALVE    

$500.00

1

$500.00

10

A5-0182

Valve, 12VDC     

$55.00

2

$110.00

11

A5-0390

Flow Switch,3/8″ NPT,1-10LPM      

$285.00

1

$285.00

12

2901-0040

Digital Panel Meter Assy

$159.00

1

$159.00

13

5107-0010

Door Interlock Switch

$10.00

1

$10.00

14

5107-0020

Cabinet Interlock

$50.00

1

$50.00

15

5300-0060

Thermstat Interlock “A”

$25.00

1

$25.00

16

5300-0070

Thermstat overcool “B”

$25.00

1

$25.00

17

5300-0090

ThermstatOpen=150F CL=135F

$25.00

1

$25.00

18

7100-0326-01-AW

TC ASSEMBLY, T-SHAPE, QUARTZ      

$275.00

1

$275.00

19

7100-0874-11

ERP Pyro, Water Cooled

$6,800.00

1

$6,800.00

20

2100-0900-078

PCA, Main Control Board

$3,650.00

1

$3,650.00

21

2100-0900-054

PCA, Gas Control Board

$1,250.00

1

$1,250.00

Subtotal

 

Spare Kit, Level 3

22

A5-1001-02       

Contactor, 3-P

$280.00

1

$280.00

23

045-0119

RELAY, SOLID STATE, 240 VAC, 25A 

$60.00

6

$360.00

24

7400-0066-03

Quartz Isolation Tube with pyrometer window

$4,180.00

1

$4,180.00

25

7400-0082-01-4

6-inch tray for 4 to 6 inch wafers.

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610 RTP Steady Time to Temperature

The current 610 RTP oven design is limited to the Time at Temperature limits listed below. High Temperature processing has many “Ins and Outs” of strategies and compromises.  Be sure to let Allwin21 know the details of your process requirements. With the current oven design, customers wanting to use the 1050C to 1250C range of processing need to let Allwin21 know…

Time (sec) — the amount of time to elapse for this step. …

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RF Bias Function

 Combines the DC or RF sputtering and the RF etching operations. While DC or RF power is applied to the target, a small amount of RF is also applied to the substrate table. As a result, the substrate and target are both bombarded by ions ( the substrate to a lesser extent than the target ).…

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RF Etch function

Essentially the reverse process of RF diode sputter deposition, in which the substrate table becomes the cathode (negative pole) and the target assembly becomes the anode (positive pole). Under these circumstances, surface material from the substrates is ejected. Surface impurities are ejected along with substrates material, making this process useful for pre-cleaning substrate prior to sputter deposition.…

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Reactive Sputtering

Some metals, such as nitrides and oxides, are best deposited by this method: the target is the parent metal and a small amount of nitrogen or oxygen is introduced into the process chamber along with the argon sputtering gas. Because ionized gases are typically highly reactive, a film deposited in a mixture of argon and a reactive gas will often form a compound with the reactive gas (e.g.,…

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Co-Sputtering Deposition

Sometimes called co-sputtering or dual deposition, co-deposition is identical in principle and practice to other types of sputter deposition, except that two targets (typically of different materials) are simultaneously activated. Substrates passing sequentially and repeatedly beneath the targets are coated with alternating, very thin films of two materials.…

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