AccuThermo AW610M Semi-Auto RTP System
45+ Years Production-Proven RTP Technology
Desktop Semi-Auto RTP System for up to 6-Inch Wafers
Real-Time RTP Control
Real-time millisecond-level RTP control architecture.
Customer Gets:
Better repeatability and smoother thermal processing behavior.
Six-Zone Lamp Control
21-lamp, 6-zone RTP thermal control architecture.
Customer Gets:
Better process tuning, substrate adaptation, and thermal profile control.
PowerSum Process Monitoring
RTP thermal behavior and process drift monitoring technology.
Customer Gets:
Earlier drift detection, easier troubleshooting, and improved process stability.
The AW610M combines officially licensed AG Associates Heatpulse RTP hardware heritage with Allwin21 modernized hardware and proprietary RTAPRO real-time software for advanced semiconductor and compound semiconductor thermal processing.
The Allwin21 AccuThermo RTP platform is based on officially licensed AG Associates Heatpulse RTP technology heritage, representing more than 45 years of proven RTP technology development since the original AG Associates RTP systems introduced in the 1980s.
Its value is not only the worldwide installed base in semiconductor fabs, universities, and research institutes, but also the production-proven chamber architecture developed through decades of real semiconductor processing experience. Allwin21 continues this proven RTP platform with modern PC-based architecture, proprietary RTAPRO software, real-time lamp power control, PowerSum monitoring, lamp intensity limiting control, and worldwide engineering support.
1. AG Production-Proven Hardware Platform
Aluminum chamber structure, diffuse gold-coated chamber reflector architecture, optimized cooling-water paths, isolated quartz tube design, ERP pyrometer integration, IR lamp layout, quartz tray, and susceptor options are based on decades of AG Heatpulse RTP application history.
Customer Gets:
- Lower technology risk
- Proven thermal architecture
- Stable long-term RTP process platform
2. Allwin21 Modernized Hardware
Allwin21 improvements include SSR lamp control, embedded industrial control computer, dual TC terminals, two TC assembly options, 1–6 gas lines with MFCs and shut-off valves, larger chassis, CDA idle shutoff, and optional individual water-flow monitoring for each cooling-water circuit.
Customer Gets:
- Better serviceability
- More flexible process development
- Improved reliability and easier maintenance
3. Process-Oriented RTP Software
The Allwin21 RTAPRO software architecture was originally developed by semiconductor process engineers with practical RTP process-development experience dating back to the 1980s.
Unlike many RTP systems focused mainly on machine operation, RTAPRO was designed to help process engineers and equipment engineers better understand RTP process behavior, thermal transitions, lamp response, process drift, and long-term equipment stability during real process development and production operation.
Many RTP process variables, I/O conditions, analog signals, lamp behavior, PowerSum response, and system-status information are directly visible through the software architecture, helping engineers identify process instability or equipment-related changes more efficiently.
Customer Gets:
- Better process visibility
- Easier troubleshooting
- Faster process optimization
- Improved long-term RTP process control
4. Application Experience & Worldwide Support
AG Heatpulse and Allwin21 AccuThermo RTP systems have been used worldwide in universities, research institutes, and 2 to 8 inch semiconductor fabs. Allwin21 continues to support RTP users with parts, upgrades, application discussion, installation, and engineering service.
Customer Gets:
- Experienced RTP support
- Practical configuration guidance
- Long-term serviceability
Process Results vs. Temperature Uniformity
For RTP applications, direct TC temperature uniformity alone may not represent final process performance. Sheet resistance, film thickness, contact resistance, SEM results, and repeatability often provide more meaningful process evaluation.
Customer Gets:
- Better acceptance criteria
- Less confusion during process development
- More practical RTP evaluation
Atmospheric RTP vs. Vacuum RTP
Many RTP applications do not require vacuum RTP. For many processes, thermal repeatability, gas purity, O₂ / moisture control, chamber design, and process understanding are more important than vacuum level alone. Vacuum RTP systems may also introduce additional contamination sources, increased maintenance complexity, and reduced process repeatability at high temperatures due to chamber structure and cooling requirements.
Customer Gets:
- Avoid unnecessary complexity
- Better model selection
- Practical RTP configuration guidance
Cooling Water Stability
Closed-loop cooling water is recommended for stable RTP chamber cooling and long-term reliability. Because RTP is a high-temperature thermal processing system, a dedicated cooling-water loop is recommended whenever possible. Distilled water is recommended instead of D.I. water for chamber cooling.
Customer Gets:
- Reduced corrosion risk
- More stable chamber behavior
- Better long-term equipment reliability
Susceptor Selection
The appropriate susceptor depends on budget, substrate size, material, thickness, emissivity, wafer bow, backside surface condition, ramp-rate requirements, patterned surface condition, process temperature, throughput, and application requirements. Susceptor size and configuration can also affect achievable ramp rates, thermal repeatability, and process flexibility. Susceptor base or susceptor base + lid configurations may be recommended depending on process sensitivity and wafer surface conditions.
Customer Gets:
- Better process and budget matching
- Reduced wafer handling risk
- Improved thermal repeatability potential
- More suitable RTP configuration for application-specific process needs
| Item | AW610M Specification |
|---|---|
| Ramp-Up Rate | Programmable from 1°C to 250°C/sec.
More detailsTypical compound semiconductor applications use 1°C to 50°C/sec depending on process, substrate size, substrate material, and susceptor configuration.
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| Steady-State Temperature | Typical steady-state range: 150°C to 1150°C.
More detailsMaximum temperature up to 1250°C depending on process conditions, wafer size, susceptor configuration, process gas, and system configuration.
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| Steady-State Duration | 0 to 9999 seconds per recipe step.
More detailsTypical RTP applications use 1 to 600 seconds per step. Longer steady-state time should be reviewed based on temperature, substrate, gas, and application requirements.
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| Ramp-Down Rate | 1°C to 200°C/sec. Programmable within natural cooling capability.
More detailsActual cooling rate is temperature- and substrate-dependent. Cooling can be fast at high temperature and gradually decreases at lower temperature.
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| Temperature Accuracy | Thermocouple measurement resolution / accuracy: ±0.5°C under controlled conditions. |
| Temperature Repeatability | ±0.5°C or better at 1150°C under controlled conditions.
More detailsBased on wafer-to-wafer repeatability test under controlled process conditions. Actual repeatability depends on substrate, fixture, sensor configuration, process recipe, and facility stability.
|
| Temperature Uniformity | ±5°C across a 6″ / 150 mm wafer at 1150°C.
More detailsBased on one-sigma deviation from 100 Å oxide uniformity measurements. For a titanium-silicidation process, no more than 1.5% increase to uniformity during the first anneal at 650°C to 700°C.
RTP performance is application dependent. Allwin21 generally does not recommend using multi-point thermocouple wafers as the primary process monitoring method, especially above approximately 600°C, because the actual substrate temperature may differ from thermocouple readings and high-temperature thermocouple measurement itself has significant tolerance and process dependency. Final process results such as sheet resistance, film thickness, contact resistance, device performance, surface condition, or SEM results may be more meaningful process acceptance criteria. For production fabs, Allwin21 PowerSum monitoring can also be used as an effective process and equipment monitoring parameter for long-term RTP process control and drift monitoring. |
| Process / Purge Gases | Supports common RTP process and purge gases.
More detailsTypical gases include N₂, O₂, Ar, He, forming gas, NH₃, and N₂O. Process gases should be regulated to 30 PSIG and pre-filtered to 1 micron.
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| Item | AW610M Standard Configuration |
|---|---|
| System Type | Desktop Semi-auto single-wafer RTP / RTA / RTO / RTN system. |
| Wafer Handling | Manual loading into quartz tray and quartz isolation tube. |
| Wafer Size Capability | Supports small samples and 2”–6” wafers, configuration dependent.
More detailsSupports small samples, 2”, 3”, 4”, 5”, and 6” / 150 mm wafers depending on quartz tray and susceptor configuration.
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| Metal Chamber Assembly | Standard AW610M RTP chamber with 21 lamps and 6-zone control.
More detailsIncludes top and bottom infrared lamp heating, diffuse gold-coated reflector architecture, and independent lamp-bank control with recipe-level lamp factor adjustment.
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| Chassis Assembly | Embedded industrial computer included for reduced ESD risk.
More detailsIncludes industrial control computer, main control electronics, DC power supply, gas lines with MFC, cooling water / CDA gauges, meters, valves, and switches.
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| Process Gas and MFC | One 10 SLM MFC included.
More detailsStandard gas line includes one 10 SLM MFC and shut-off valve. Gas type is configured based on the customer’s application-specific process gas requirement.
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| Standard Isolated Quartz Tube | Standard isolated quartz tube included.
More detailsIsolated quartz tube design optimized for a wide range of RTP applications and contamination control. During long-term RTP processing, chamber contamination such as metal deposition is normal depending on the application and materials. The isolated quartz tube can be removed easily for cleaning or replacement, helping restore chamber condition with lower maintenance effort and reduced downtime. This design is also advantageous compared with some integrated vacuum chamber RTP designs where contamination recovery and chamber maintenance can be more difficult.
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| Standard Quartz Trays | Standard quartz trays available for 2 to 6 inch round or square substrate.
More detailsStandard quartz trays available for 2”–4” round wafers, 4”–6” round wafers, and 100×100 mm to 156×156 mm square wafers. Quartz tray selection depends on substrate size, shape, thickness, wafer bow condition, and application requirements. Application-specific tray configurations are also available.
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| Thermocouple | One thin K-type T-shape thermocouple assembly included.
More detailsIncludes one RTP-optimized thin K-type thermocouple assembly and five spare thermocouple wires. K-type thermocouple design has been widely used in legacy AG Associates RTP systems for many years due to its stability, availability, and suitability for rapid thermal processing applications. Typical measurement range is approximately 100°C to 840°C depending on process conditions, mounting configuration, and application requirements.
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| Manuals & Software | USB drive with manuals, software, and schematics included.
More detailsIncludes backup software, installation manual, operation manual, service manual, facility connection drawings, and AW610M schematics.
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| Item | Optional Configuration / Capability |
| ERP Pyrometer | Optional non-contact AG Associates patented ERP pyrometer technology for approximately 400°C–1250°C RTP applications.
More detailsTypical calibrated accuracy: approximately ±1°C against instrumented thermocouple wafer (ITC), application dependent. The qualified ERP pyrometer package includes pyrometer sensor configuration, dedicated closed-loop recirculating chiller, Omega meter, and single-point instrumented thermocouple wafer (ITC). ERP pyrometer measurement is non-contact and commonly recommended for RTP applications above approximately 400°C where process repeatability, fast thermal response, and long-term stability become increasingly important. Thermocouple measurement remains widely used for many lower-temperature and research RTP applications depending on process goals and budget considerations. IMPORTANT: Use only the dedicated Allwin21-supplied closed-loop chiller system for ERP pyrometer cooling. |
| More Process Gas Lines | Optional additional gas lines with support for up to 6 MFCs.
More detailsAdditional process gas lines are available with optional shut-off valves, gas routing configurations, and application-specific gas configurations.
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| Application-Specific Susceptors | 3”, 4”, 6”, 4×2-inch, and 3×3-inch susceptors available.
More detailsSusceptor selection depends on substrate material, transparency to IR heating, wafer size, patterned or metalized surface condition, backside quality, process sensitivity, repeatability requirements, throughput, ramp rate requirements, and budget considerations. Susceptor base or susceptor base + lid configurations are available depending on application requirements. Susceptors are commonly recommended for transparent substrates, small samples, patterned or metal-coated wafers, and pyrometer-based RTP applications with non-uniform or non-repeatable substrate backside conditions where stable thermal coupling and repeatable temperature measurement are important. Larger susceptors generally reduce achievable ramp rates due to higher thermal mass. For example, smaller susceptors may support higher ramp rates compared with larger multi-size susceptors used for flexibility and throughput. Standard long-term qualified graphite susceptors with SiC coating are recommended for best RTP performance and repeatability. Single-wafer or multi-wafer susceptor configurations are available depending on process sensitivity and throughput requirements.
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| Application-Specific Quartz Trays | Standard and/or custom quartz trays available for special substrates.
More detailsStandard quartz trays available for 2”–4” round wafers, 4”–6” round wafers, 100 × 100 mm to 156 x 156 mm square substrates.
Custom quartz trays are available for special wafer configurations, thin wafers, square substrates, fragile substrates, bowed wafers, and application-specific process requirements. Quartz tray selection depends on substrate size, thickness, wafer bow, loading method, thermal process condition, and substrate fragility. |
| Special Quartz Tube Configuration | Optional quartz tube with liner for heavy outgassing applications. |
| O₂ Protection | Optional dual O-ring and O₂ protection configuration available.
More detailsRecommended for sensitive compound semiconductor applications and oxygen-sensitive thermal processes. The standard RTP chamber design already provides good sealing performance for most RTP applications. The optional dual O-ring and O₂ monitoring configuration provides additional process monitoring and protection capability for customers requiring extra safety margin and process assurance for high-value production wafers. The dual O-ring configuration helps verify chamber sealing conditions before heating starts, while the O₂ monitoring function provides additional process atmosphere monitoring during operation. This dual-layer protection concept is commonly used for high-value compound semiconductor production applications where maximum process protection and wafer risk reduction are important. For many RTP applications, practical process repeatability, gas purity, moisture control, and stable process conditions are often more important than achieving extremely low oxygen levels. Depending on the application, typical O₂ levels in the approximately 10–25 ppm range may already be suitable for many RTP processes.
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| Cooling Water Monitoring | Optional individual water-flow monitoring for each cooling-water circuit available. |
| Shield TC | Optional shield thermocouple configuration available.
More detailsOptional shield thermocouple configuration similar to legacy MPT 600S / 800S RTP systems is available for selected applications and customer preference. This option is especially useful for customers previously using MPT RTP systems who prefer similar thermocouple structure, process setup, and operational experience. Compared with the standard exposed-junction RTP thermocouple configuration, shield thermocouple structures may have slower thermal response due to the protective shield structure and grounded configuration. For this reason, Allwin21 generally recommends the standard RTP thermocouple configuration for new RTP applications unless compatibility with existing MPT process setup or customer preference is important.
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| Support & Service | Optional spare parts, installation, training, and process support.
More detailsWorldwide engineering support, startup assistance, RTP training, process discussion, remote support, and field service are available depending on customer requirements.
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| GEM/SECS Interface | Optional GEM/SECS factory communication interface.
More detailsSupports communication with factory automation systems and fab host / MES integration when required.
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| Facility Item | Typical Requirement |
|---|---|
| Electrical | Typical: 50–60 Amps. 208–240 VAC, 60 Hz, 3-phase, 4-wire — North America typical 200 VAC, 50/60 Hz, 3-phase — Japan typical 380–415 VAC, 50 Hz, 3-phase, 5-wire — Europe / China typical Please confirm facility power configuration before order placement. |
| Cooling Water | Closed-loop cooling water recommended Typical flow: 2–4 GPM Typical pressure: 30–40 PSI Recommended temperature: approximately 20°C Typical fitting: 1/2″ tubing Recommended chiller: SMC HRSF060-AN-20 or equivalent industrial closed-loop recirculating chiller |
| Quartz Tube Cooling Gas / CDA | N₂ or CDA Oil-free and water-free gas recommended Typical pressure: 15–30 PSI Typical flow: 10–15 SCFM Typical fitting: 3/8″ tubing |
| Process Gases / Exhaust | N₂ / O₂ / Ar / He / Forming Gas / NH₃ Typical process gas pressure: 10–30 PSI Typical fitting: 1/4″ VCR 4-inch exhaust duct recommended |
| Item | Information |
|---|---|
| AW610M Equipment Dimensions | 26″ W × 21″ D × 14″ H |
| AW610M Net Weight | Approximately 100 lbs |
| Shipping Crate Dimensions | 38″ W × 36″ D × 35″ H |
| Shipping Weight | Approximately 275 lbs |
Please provide as much information as possible in the RTP Survey PDF and email the completed survey to sales@allwin21.com and/or allwin21corp@gmail.com.
The more complete and accurate your responses are, the better we can recommend the most suitable RTP model or configuration for your specific needs, based on our 45+ years of RTP technology heritage and thousands of successful installations worldwide.
Completing the survey thoroughly helps ensure optimal system performance while avoiding unnecessary options that do not contribute to your application.
- Product photos and descriptions are for general reference only.
- Final configuration, options, specifications, facility requirements, lead time, and delivery schedule shall be confirmed by Allwin21 official quotation and technical documents.
- Facility requirements depend on actual system configuration, process gases, pyrometer option, O₂ protection option, and customer process requirements.
- OEM trademarks belong to their respective owners.
