RTP Selection and Configuration Form

Please provide the following process requirements and planning information. Based on your application requirements, Allwin21 will recommend a suitable RTP model and configuration.

Contact Information

1. Your Name (Required):

2. Your Email (Required):

3. Company Name (Required):

4. Company Address (Required):

Process Requirements

5. Application:
AnnealingOhmic ContactDopant ActivationOxidationAlloyResearchProductionOtherNot sure

6. Substrate Material (Required):
SiSiCGaAsGaNGaInPInPOtherNot sure

7. Substrate Size / Maximum Size (Required):
<2 inch2 inch3 inch4 inch5 inch6 inch8 inchOtherNot sure

8. Substrate Shape:
RoundSquareRectangularOtherNot sure

9. Substrate Thickness:
≤200 µm200–1000 µm>1000 µmNot sure

10. Substrate Special Characteristics:
Metal thin film or patterned metal on the top surface during RTPNon-uniform or patterned bottom surface

11. Process Gases (Required):
N2O2ArNH3N2ON2 Forming GasAr Forming GasOtherNot sure

12. Highest Process Temperature (°C) and Hold Time(sec)(Required):
Temperature (°C):

Hold Time (sec):

13. Longest Process Time (sec) and Temperature(°C):
Process Time (sec):

Temperature (°C):

14. Current or Previous RTP System (Manufacturer and Model):

15. How do you evaluate RTP process results?
Sheet ResistanceContact ResistanceFilm ThicknessUniformityAppearanceSEMYieldOtherNot sure

Planning

16. Throughput Requirement:
R&D<5 substrates/day5–10 substrates/day10–20 substrates/day20–50 substrates/day>50 substrates/dayNot sure

17. Approximate Budget:
< USD $50KUSD $50K–100KUSD $100K–200KUSD $200K–300KUSD $300K–400KUSD $400K–500K> USD $500KNot sure

18. Approximate Purchase Timeline:
<1 month1–3 months3–6 months6–12 months>12 monthsNot sure

19. Future Expansion Plan:

Additional Information

20. Please share any additional application details, challenges, previous experience, process concerns, or future plans that may help us better understand your requirements.

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