Archive | Plasma Etch RIE Equipment

Allwin21 Corp. has been focusing on providing solutions and enhancements to plasma Etch RIE semiconductor process equipment. These OEM Etch RIE semiconductor equipment have been used in productions and R&D since 1990′s. They have been Process-Proven. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC, solid 3-axis robotic wafer transfer system, and new critical components to achieve the goal of giving our customers a production edge.

AW-2001R Etcher

Manufacturer: Allwin21 | Condition: New | Wafer Size: 2"/3"/4"/5"/6"Capability | Wafer loading: Automatic, Solid Robotic Wafer Transfer-Allwin21 Own Technology | Plasma Power: Microwave | Type: Parallel/Single Wafer Process,Stand Alone | Gas Lines: 4 lines with customized MFCs range

AW-2001R with solid robotic wafer transfer (optional)
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AW-901e Plasma Etch RIE

Manufacturer: Allwin21| Condition: New | Wafer Size: 3"/4"/5"/6"Capability |  Wafer loading: Automatic, Original Belt-Shuttle-Wafer-Transfer OR Allwin21 Solid-Robotic-Wafer-Transfer | Plasma Power: RF,13.56MHz | Type: Parallel/Single Wafer Process/Plasma Etch/RIE/Stand Alone | Etch Materials: Polysilicon, Refractory metal silicides and Nitride | Gas Lines: 1~4 lines capability with customized MFCs range

The robust integrated robotic wafer transfer for Tegal 901e Tegal 90e
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AW-903e Plasma Etch RIE

Manufacturer: Allwin21| Condition: New | Wafer Size: 3"/4"/5"/6"Capability |  Wafer loading: Automatic, Original Belt-Shuttle-Wafer-Transfer OR Allwin21 Solid-Robotic-Wafer-Transfer | Plasma Power: RF,13.56MHz | Type: Parallel/Single Wafer Process/Plasma Etch/RIE/Stand Alone | Etch Materials: Silicon Oxide | Gas Lines: 1~4 lines capability with customized MFCs range

The robust integrated robotic wafer transfer for Tegal 901e Tegal 90e
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AW-901e TTW Plasma Etch RIE

Manufacturer:Tegal | Condition:Fully Refurbished&Upgraded By Allwin21 | Wafer Size:3"/4"/5"/6"Capability |  Wafer loading: Automatic, Allwin21 Solid-Robotic-Wafer-Transfer | Plasma Power: RF,13.56MHz | Type:Parallel/Single Wafer Process/Plasma Etch/RIE/Through-The-Wall(TTW) | Etch Materials: Polysilicon, Refractory metal silicides and Nitride | Gas Lines:1~4 lines capability with customized MFCs range

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AW-903e TTW Plasma Etch RIE

Manufacturer: Tegal | Condition: Fully Refurbished&Upgraded By Allwin21 | Wafer Size: 3"/4"/5"/6"Capability |  Wafer loading: Automatic, Allwin21 Solid-Robotic-Wafer-Transfer | Plasma Power: RF,13.56MHz | Type: Parallel/Single Wafer Process/Plasma Etch/RIE/Through-The-Wall(TTW) | Etch Materials: Silicon Oxide | Gas Lines: 1~4 lines capability with customized MFCs range

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