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Upgrade Kits for Legacy Semiconductor Equipment

Still running an older Matrix, Gasonics, Tegal, Lam, AG Associates, MPT, Perkin-Elmer, MRC, Temescal, or KLA-Tencor system?

Allwin21 upgrades selected legacy semiconductor process tools with new controller hardware, Allwin21 software, modern interface boards, wafer handling upgrades, and replacement of obsolete key modules when required.

See your OEM and model immediately
Stop fighting obsolete boards, old PCs, and unsupported software
Upgrade at your facility in many cases — often much faster than expected
Keep useful process hardware when the chamber and process are still worth saving
Allwin21 upgrade kits for legacy semiconductor equipment

Allwin21 upgraded legacy semiconductor equipment
Proven Legacy Platforms • Modern Controls • Engineer Software • Long-Term Support

Download Upgrade Kit RFQ PDF

Looking for One of These Legacy Systems?

AG Associates / Heatpulse

Heatpulse 210
Heatpulse 310
Heatpulse 410
Heatpulse 610

Modular Process Technology / MPT

MPT RTP-600S
MPT RTP-600XP
RTP-800S
RTP-800XP
MPT RTP-3000

Matrix

Matrix 105, 106, 104, 205, 206
Matrix 303, 302, 403, 10 Series
Matrix 1104, 1107,1108, 1303, 1307

Gasonics

Gasonics Aura 1000
GasonicsAura 2000LL
GasonicsAE 2000LL
Gasonics Aura 3000
Gasonics Aura 3010
Gasonics L3510

Branson / IPC

Branson/IPC 2000 Series
4000 Series
Branson/IPC 3000 Series
L3200 Series

Tegal

Tegal 901e
Tegal 903e
Tegal 900
Tegal 915, Tegal 965
Tegal 981
Tegal 983

Lam Research

Lam AutoEtch 490, 590, 690, 790
Lam Rainbow 4400, 4500, 4600, 4700
Lam Rainbow 4420, 4520, 4620, 4720

PlasmaTherm RIE, ICP, DRIE, PECVD

PlasmaTherm 790
PlasmaTherm 720
PlasmaTherm 730
PlasmaTherm 740
PlasmaTherm 770
PlasmaTherm 700

Perkin-Elmer, TES

TES PE-4400 Series
TES PE-4410 Series
PE-4450 Series
4415 Series
2400 Series

KLA-Tencor

Mgage 200
Mgage 300
Sonogage 200
Sonogage 300

Oxford PlasmaLab RIE, ICP, PECVD

Oxford PlasmaLab 133
Oxford PlasmaLab 100
Oxford PlasmaLab 800
Oxford PlasmaLab 80
Oxford PlasmaLab 80 plus

MRC-Materials Research Corp, TES

TES MRC 603
TES MRC 643
TES MRC 8671
TES MRC 903
TES MRC 923
TES MRC 943

Temescal, TES Sputter, Evaporator

Temescal FC-1800
Temescal BJD-1800
TE VCT-1800
Temescal VES 2550

Other Legacy Semiconductor Tools

SputterTech 4XXX
Legacy RTP / RTA
Legacy Asher
Legacy Etcher
Legacy PVD
Do not see your model? Send the OEM, model, serial number, photos, current condition, and application. We can discuss selected legacy semiconductor equipment platforms even if the exact model is not listed above.

Does Any of This Sound Familiar?

Nobody Wants to Touch the Software

The old PC still runs, but nobody is comfortable changing recipes, rebooting the system, or replacing the computer.

More details

Many legacy systems still depend on old operating systems, old interface boards, and software that only one experienced engineer understands. When that engineer leaves, daily operation becomes risky. The tool may still run, but every recipe change or computer problem becomes a production concern.

One Failed Board Can Shut the Tool Down for Months

The equipment is useful, but one obsolete PCB, controller, or power module can stop production.

More details

Many fabs keep old boards, used parts, repaired parts, and unknown spare parts because the original supply chain is gone. The real issue is not just finding one board. The real issue is long-term supportability.

We Keep Replacing Parts, But the Problem Comes Back

A board is repaired, a sensor is replaced, or a module is swapped — then another problem appears.

More details

At some point, a legacy tool may be repairable but not truly reliable. Different suppliers may fix different symptoms, but nobody owns the complete tool architecture. A modernization plan can often reduce repeated troubleshooting cycles.

The Robot Drops Wafers

Wafer transfer errors, cassette issues, alignment problems, and fragile wafer handling cause real production pain.

More details

Legacy wafer handling problems may come from worn mechanics, obsolete electronics, old sensors, old software logic, or a combination of all of them. For automatic single-wafer tools, a solid integrated robotic wafer transfer upgrade can reduce wafer breakage risk and improve long-term reliability.

The Tool Runs Today, But Nobody Trusts It Tomorrow

The system is still valuable, but engineers are never fully confident it will stay stable.

More details

Intermittent faults are often the most painful problems. The tool may pass a simple test, then fail during production. Engineers need history, trends, signals, and comparison between good runs and bad runs — not just a final alarm message.

Engineers Spend More Time Troubleshooting Than Running Wafers

Production time is lost because engineers are searching for the cause instead of improving the process.

More details

When the system does not show enough information, troubleshooting becomes guesswork. The question is usually simple: what changed? The hard part is finding when it changed and which signal changed first.

The OEM Stopped Supporting the Tool Years Ago

The chamber still has value, but the original support path is gone.

More details

Many legacy tools still have useful process hardware, stable chamber behavior, and qualified recipes. The problem is often the controller, electronics, software, wafer handling, or obsolete modules around the chamber.

Every Shutdown Turns Into a Fire Drill

When the tool goes down, the fab starts searching for parts, old notes, old suppliers, and anyone who remembers the system.

More details

This is why many customers eventually move from repair-only thinking to upgrade planning. The goal is not only to recover from today's failure. The goal is to reduce the chance of the same type of shutdown happening again.

Three Upgrade Levels — Usually Simpler Than Customers Expect

Level 1 — Controller, PCB, and Allwin21 Software Upgrade

Typical scope may include:

New controller hardware and modern interface electronics
New PC and Allwin21 equipment software
New or redesigned PCB architecture with more useful equipment signals
Recipe control, alarm review, signal screens, trends, and troubleshooting support

Why customers choose this level:

Old PC and obsolete boards are creating support risk
Engineers need to see more signals instead of guessing
The chamber and process are still useful
The fab wants a practical path to keep the tool running
Engineer-Driven Software: what does it really do?

The purpose of Allwin21 software is not just to make a nicer screen. The purpose is to help equipment engineers and process engineers do their daily work faster.

Legacy systems often do not show enough information. Some signals are hidden inside old control boards. Some useful signals were never collected because the old hardware architecture was limited.

Allwin21 upgrades expose more equipment information, including digital I/O, analog signals, temperature information, RF-related information, motion status, recipe information, equipment history, and subsystem status depending on the tool configuration.

Instead of guessing, engineers can compare a good run to a bad run, review stored data, look at trends, and identify what changed. In many support cases, the customer can open the related screen, take photos or screenshots, and send them to Allwin21 engineers for faster troubleshooting.

The signal was often inside the equipment. The upgrade makes it visible, stores it, and turns it into useful engineering information.

Level 2 — Level 1 + Integrated Robotic Wafer Transfer

Typical scope may include:

Controller, PCB, and Allwin21 software upgrade
Integrated solid robotic wafer transfer for automatic single-wafer tools
Replacement of obsolete handling modules where applicable
Improved wafer transfer reliability and serviceability

Why customers choose this level:

Wafer breakage or transfer errors are creating real production loss
Original robot parts are obsolete or difficult to support
The customer wants lower handling risk and easier troubleshooting
Automatic single-wafer operation is still required
Why upgrade wafer handling?

Wafer handling problems are rarely just one mechanical problem. They can involve old robot electronics, sensors, software logic, cassette transfer, alignment, timing, and worn mechanical parts.

A modern integrated wafer transfer upgrade can reduce dependence on obsolete handling modules, improve repeatability, and help protect valuable wafers from unnecessary handling failures.

For fragile substrates and compound semiconductor wafers, better handling is not just convenience. It directly affects wafer loss, downtime, and operator confidence.

Level 3 — Level 1 or Level 2 + Key Subsystem Replacement

Typical scope may include:

New air-cooled RF generator, RF matching network, DC or pulse DC power supply
New MFCs, Baratron, throttle valve, temperature controller, sensors, and key modules
Chamber-related upgrades when required by equipment condition or process need
GEM/SECS networking, compound semiconductor susceptor support, and application-specific upgrades

Why customers choose this level:

The tool is important enough for long-term ownership
Too many obsolete components are creating downtime risk
The customer wants a stable platform instead of repeated emergency repair
Production, process development, or compound semiconductor work requires higher confidence
Why replace obsolete subsystems instead of repairing them again?

Sometimes repairing one board or one module is not enough. If RF, matching, gas control, pressure control, temperature control, sensors, or handling modules are all aging, the tool may keep failing in different ways.

Subsystem replacement can reduce the dependence on unknown used parts and questionable repairs. It also gives the software more useful signals to monitor, store, compare, and display.

The goal is to turn a fragile legacy tool into a more supportable production platform.

Wait — is this going to become a six-month project?
Usually not. Many customers are surprised how quickly a legacy semiconductor tool can be modernized when the original chamber, facility connections, and qualified process platform can remain in place.
RTP / RTA
~1 Day
Plasma Asher
~1 Day
Etch / RIE
1–2 Days
PVD / Sputter
2–5 Days
Why can many upgrades be completed so quickly?

Many upgrade projects keep the original process chamber, mechanical platform, facility connections, and qualified process history. The upgrade focuses on controller hardware, software, interface boards, wafer handling, and selected obsolete subsystems based on the tool condition and customer requirements.

Most RTP, plasma asher, and plasma etcher upgrades can often be performed at the customer's facility. PVD and more complex systems may require more time. Only a small number of projects require shipment to Allwin21.

The final scope, installation schedule, and expected downtime are defined in the formal quotation after Allwin21 reviews the equipment model, photos, condition, configuration, and customer requirements.

Why So Many Customers Upgrade Instead of Fighting the Same Tool Again

Keep the Process Hardware That Still Works

Many older chambers, thermal platforms, RF platforms, and vacuum platforms still have useful process value
The weak point is often old controls, old software, obsolete electronics, or unsupported modules
Upgrade can be a practical path when the process is already qualified

Stop Blind Troubleshooting

More I/O, analog, sensor, history, and subsystem information can be visible from the screen
Engineers can compare good runs and bad runs instead of relying only on memory
When something changes, the system gives engineers more places to look first

Reduce Obsolete Parts Dependency

Old PCs, old boards, obsolete controllers, and unsupported modules are common downtime risks
Modern control hardware and redesigned boards help create a more supportable platform
The goal is fewer emergency repairs and a clearer long-term support path

Work With Engineers Who Understand Equipment

Allwin21 upgrades are built around real equipment engineering, process engineering, and field service experience
The discussion starts with your tool, your process, your failure history, and your real production problem
The upgrade proposal is based on actual tool condition and customer requirements

Upgrade the Old Tool or Buy a New Allwin21 System?

Upgrade Usually Makes Sense When

The chamber and main process platform are still good
The process is already qualified and the customer wants minimum process disruption
The main pain is controller, software, PCB, handling, or obsolete module support
The customer wants to keep a useful production tool running with lower risk

New Equipment May Make More Sense When

The old platform is too worn, incomplete, or mechanically unstable
Throughput, wafer size, automation, safety, or long-term production needs have changed
The customer wants a clean start with a modern Allwin21 RTP, plasma asher, plasma etcher, PVD, or metrology system
Buying another old used tool would simply restart the same pain with another obsolete system

Allwin21 can discuss both paths: upgrade a proven legacy tool when it still makes sense, or help the customer move to a modern Allwin21 platform when the old equipment is no longer the best long-term choice.

Many customers first know Allwin21 through a legacy tool upgrade. Later, when they need new equipment, they already know who understands their process tools.

Request an Upgrade Kit Review

Please complete the Upgrade Kit RFQ survey and send it with equipment photos, nameplate photos, current condition, application, wafer size, process gases, known problems, and your upgrade goal.

Download Upgrade Kit RFQ PDF
Email Sales

Backup email: allwin21corp@gmail.com

Additional Upgrade Kit Keywords and Legacy Equipment References

Semiconductor equipment upgrade kit, legacy semiconductor equipment upgrade, obsolete semiconductor equipment support, controller upgrade, PCB upgrade, software upgrade, Allwin21 software, semiconductor tool modernization, RTP upgrade, RTA upgrade, plasma asher upgrade, plasma descum upgrade, plasma etcher upgrade, RIE upgrade, sputter system upgrade, PVD upgrade, wafer handling upgrade, robotic wafer transfer upgrade, AG Associates Heatpulse, MPT RTP, Matrix asher, Gasonics Aura, Gasonics L3510, Branson IPC, Tegal 901e, Tegal 903e, Lam AutoEtch, Lam Rainbow, Perkin-Elmer sputter, MRC sputter, Temescal, KLA-Tencor Mgage, Sonogage, legacy tool obsolescence, obsolete spare parts, semiconductor equipment downtime, equipment troubleshooting, good run bad run comparison, I/O signal monitoring, analog signal monitoring, equipment history, process stability, tool uptime.

MPT RTA-600S RTA-600XP RTA-800S RTA-800XP Upgrade

Modular Process Technology Corporation was founded in 1991. Modular Process Technology supplies rapid thermal processing (RTP) solutions for silicon, compound semiconductor, integrated photonics, and MEMS device processing. The Company’s line of business includes manufacturing industrial furnaces and ovens. Models: RTP-600S, MPT RTP-600XP, MPT RTP-800S, MPT RTP-800XP,MPT RTA-3000.…

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MRC 6X3 9X3 Sputtering System Upgrade

The AW-603/903 Sputter System Upgrade Kit includes an advanced control system with touch screen operator interface and Allwin21 computer software. The kit is easy to incorporate (plug-and-play) into the original MRC 6X3/9X3 sputter system. No need to move the to be upgraded system from its present location.…

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Lam AutoEtch X90 Upgrade

The Upgrade kit for Lam AutoEtch® 490 590 690 790 includes an advanced AW-590 System Control with touch screen operator interface or 17" LCD Monitor , New PC with Allwin21 AW-590 software  and new interface board. 

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Gasonics L3510 Upgrade

The Upgrade kit for Gasonics L3510 includes an advanced AW-3510 System Control with touch screen operator interface , New PC with Allwin21 AW-3000 software ,new main control board, new wafer heating function with Allwin21 RTP technology, fixed cassette station instead of the original elevator and robust integrated robotic wafer transfer instead of the original Z-bot . 

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Gasonics Aura 3010 Upgrade

The Upgrade kit for Gasonics Aura® 3010, Gasonics Aura® 3000 includes an advanced AW-3000 System Control with touch screen operator interface , New PC with Allwin21 AW-3000 software ,new main control board, new wafer heating function with Allwin21 RTP technology, fixed cassette station instead of the original elevator and robust integrated robotic wafer transfer instead of the original Z-bot . 

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Gasonics Aura 1000 Upgrade

The Upgrade kit for Gasonics Aura® 1000 includes an advanced AW-1000 System Control with touch screen operator interface or 17" LCD Monitor , New PC with Allwin21 AW-1000 software ,new main control board and new wafer heating function with Allwin21 RTP technology. 

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