AW-1008 Plasma Stripper/Asher

Manufacturer: Allwin21
Condition: New
Wafer Size: 3″ – 6″ Capability
Wafer Loading: 3-axis Robot
Plasma Power: Microwave
Type: Parallel/Single Wafer Process; Stand-Alone
Gas Lines: 1-4 Lines
Downloads: 
AW-1008R (PDF)
Gasonics Aura 1000 with solid robotic wafer transfer (optional)

Allwin21 AW-1000 Features:

  • Designed with III-V Production in Mind.
  • Controller with Touchscreen GUI and PentiumⓇ Grade PC.
  • Allwin21 Advanced Controller Software with PSUM technology to PREVENT MIS-PROCESSING.
  • The 3-axis wafer transport robot installed:
    • Superior than Gasonics Aura 1000 design that’s synonymous for wafer breakage and constant alarms/errors.
    • INCREASED THROUGHPUT
    • Receive cassette station can be substituted with a Cooling/Alignment station to prevent wafer breakage.
  • NO OBSOLETE PARTS.
  • Closed Loop Temperature Control (CLTC) temperature control for heating wafers up to 350°C  (± 2 – 5°C) using our proprietary RTP technology for BETTER PROCESS REPEATABILITY.
  • BETTER UNIFORMITY by using three 1kW lamps.
  • Option to run two different wafer sizes without any hardware changes.

Specifications:EOP

  • Downstream Plasma.  <0.1V CV-Shift NO ELECTRICAL DAMAGE to product.
  • Front and Backside isotropic photoresist removal.
  • Bulk Ash/Strip Rate:
    • Positive Photoresist = 2µ – 5µ / min
    • Negative Photoresist = >8µ / min
  • 1000W Microwave Power (1.25kW w/ Variable MW Power option available)
  • Small footprint.  32″w  x  32″d  x  64″h
  • 75mm – 150mm wafer capability.
  • Up to 4 MFC’s.
  • End-of- Process (EOP) process endpoint detection.
  • Pressure control.
  • GEM/SECSII (option).
  • Floor or Through-the-wall design.

Typical Recipe Parameters:

  • Pressure = 1.75 to 2.5 Torr
  • Microwave = 1000W

  • Gas Flow:
    • 02 4.5 SLPM
    • N2 0.5 SLPM
  • Variable Lamp Time = 0-9999 seconds (AW SW)
  • Variable Temperature = 150°C – 350°C

Facilities:

  • Vacuum Chamber Pump = 165 cfm
  • Cabinet Exhaust = >250 cfm
  • Plumbed Gases:
    • O2
    • N2
    • Forming Gas for metal wafers. (Optional)
    • Ar – for Metal wafer surface clean. (Optional)
  • Electrical Requirements: 208VAC, 3-Phase, 60Hz, 30Amps
  • Water Cooling only if “Variable MW Power Control” option is installed.
  • Weight = 350lbs.

 

Contact Us for More Information

RFQ-Plasma Asher Descum Clean

    Please help fill in the following Customer Survey Form for suitable Plasma Asher Descum model and configuration for your applications. Appreciate your time. Thank you very much.

    1. Your Name(Required):

    2. Your Email(Required):

    3. Your Company Name(Required):

    4. Company Address:

    5. Substrate Sizes(Required):
    small sample1 inch2 inch3 inch4 inch5 inch6 inch6.125 inch6.25 inch8 inch12 inchOthers
    6. Substrate Material(Required):
    SiSiCGaAsGaNGaInPInPOthersNot sure
    7. What are the highest and lowest process temperature(Required,°C):

    8. What is the Asher rate specification:

    9. What are the Asher Uniformity/Repeatability specifications:

    10. Amount of Gas lines(Required):

    11. What are the maximum and minimum RF power watts?

    12. Did you use any Plasma Asher Descum Equipment which met your requirements? If yes, pls specify brand and model(Required).

    13. Do you know Matrix, Branson/IPC, Gasonics plasma asher equipment?If yes, pls tell us which model you know(Required).

    14. Special Requirements:

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