AW-1008 Plasma Stripper/Asher

Manufacturer: Allwin21
Condition: New
Wafer Size: 3″ – 6″ Capability
Wafer Loading: 3-axis Robot
Plasma Power: Microwave
Type: Parallel/Single Wafer Process; Stand-Alone
Gas Lines: 1-4 Lines
Downloads: 
AW-1008R (PDF)
Gasonics Aura 1000 with solid robotic wafer transfer (optional)

Allwin21 AW-1000 Features:

  • Designed with III-V Production in Mind.
  • Controller with Touchscreen GUI and PentiumⓇ Grade PC.
  • Allwin21 Advanced Controller Software with PSUM technology to PREVENT MIS-PROCESSING.
  • The 3-axis wafer transport robot installed:
    • Superior than Gasonics Aura 1000 design that’s synonymous for wafer breakage and constant alarms/errors.
    • INCREASED THROUGHPUT
    • Receive cassette station can be substituted with a Cooling/Alignment station to prevent wafer breakage.
  • NO OBSOLETE PARTS.
  • Closed Loop Temperature Control (CLTC) temperature control for heating wafers up to 350°C  (± 2 – 5°C) using our proprietary RTP technology for BETTER PROCESS REPEATABILITY.
  • BETTER UNIFORMITY by using three 1kW lamps.
  • Option to run two different wafer sizes without any hardware changes.

 

Specifications:EOP

  • Downstream Plasma.  <0.1V CV-Shift NO ELECTRICAL DAMAGE to product.
  • Front and Backside isotropic photoresist removal.
  • Bulk Ash/Strip Rate:
    • Positive Photoresist = 2µ – 5µ / min
    • Negative Photoresist = >8µ / min
  • 1000W Microwave Power (1.25kW w/ Variable MW Power option available)
  • Small footprint.  32″w  x  32″d  x  64″h
  • 75mm – 150mm wafer capability.
  • Up to 4 MFC’s.
  • End-of- Process (EOP) process endpoint detection.
  • Pressure control.
  • GEM/SECSII (option).
  • Floor or Through-the-wall design.

Typical Recipe Parameters:

  • Pressure = 1.75 to 2.5 Torr
  • Microwave = 1000W

  • Gas Flow:
    • 02 4.5 SLPM
    • N2 0.5 SLPM
  • Variable Lamp Time = 0-9999 seconds (AW SW)
  • Variable Temperature = 150°C – 350°C

 

Facilities:

  • Vacuum Chamber Pump = 165 cfm
  • Cabinet Exhaust = >250 cfm
  • Plumbed Gases:
    • O2
    • N2
    • Forming Gas for metal wafers. (Optional)
    • Ar – for Metal wafer surface clean. (Optional)
  • Electrical Requirements: 208VAC, 3-Phase, 60Hz, 30Amps
  • Water Cooling only if “Variable MW Power Control” option is installed.
  • Weight = 350lbs.

 

Contact Us for More Information

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