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Archive | Plasma Asher Descum Equipment
Allwin21 Plasma Asher / Descum Equipment
Allwin21 plasma asher and descum systems combine production-proven plasma chamber technology, modernized Allwin21 hardware architecture, process-oriented software control, and decades of semiconductor plasma process application experience.
Production-Proven Plasma Chamber & Process Platform
Modernized Allwin21 Hardware Architecture
Process-Oriented Software Control
Decades of Installed Base & Applications
CE Marked Equipment • SEMI Member Since 2007 • 500+ Asher & Descum Systems Worldwide
Plasma Asher Product Lineup
AW-105R
Single-wafer downstream plasma asher designed for 2–6 inch low-damage descum and surface cleaning.
2–6 inch wafers
AW-10R
Single-wafer downstream plasma asher for 4–8 inch wafers with stable production control.
4–8 inch wafers
AW-B3000
Barrel batch plasma asher for high-throughput photoresist stripping and small samples.
Up to 8 inch
Gasonics L3510
Refurbished & Upgraded Automatic Single Wafer, 2.45GHz Microwave, 100~300 °C .
3 inch to 8 inch
How to Choose the Right Plasma Asher Descum System
AW-105R Downstream Plasma Asher
Single-wafer downstream plasma asher designed for 2-inch to 6-inch wafers.
Optimized for low-damage descum and surface cleaning on Si, GaAs, SiC, and InP substrates.
Used where process sensitivity and plasma control are critical.
AW-10R Downstream Plasma Asher
Single-wafer downstream plasma asher designed for 4-inch to 8-inch wafers.
Extends low-damage plasma process to larger wafer sizes.
Maintains stable production-level repeatability and process control.
AW-B3000 Barrel Batch Plasma Asher
Barrel batch plasma asher designed for small samples up to 8-inch wafers.
Optimized for high-throughput photoresist stripping.
Used when batch processing is preferred over uniformity control.
Application Review Before Model Selection
Selection depends on wafer size, substrate material, process type, and throughput requirement.
Single-wafer systems are used for controlled descum.
Batch systems are used for high-throughput stripping.
Allwin21 Plasma Asher & Descum Platform Advantages
Production-Proven Plasma Chamber & Hardware Platform
Core plasma chamber technology is inherited from historically accepted semiconductor plasma Asher & Descum platforms widely used in fabs, universities, and research institutes
Production-proven chamber behavior helps customers develop, transfer, or sustain processes with lower technical and process risk compared with completely new unproven designs
Stable and accepted process platform supports wafer-to-wafer, lot-to-lot, and long-term process consistency over daily production operation and long-term equipment usage
Modernized Allwin21 Hardware Architecture
Modernized wafer handling and subsystem architecture help reduce wafer breakage risk, operator handling variation, and daily production inconsistency
Modern RF generator, RF matching, gas control, pressure control, and electronics architecture help improve control stability compared with older analog systems
Modern electronics, modules, PCBs, Baratron, throttle valve control, and industrial PC architecture help reduce obsolete hardware dependency while improving equipment reliability, long-term serviceability, and maintenance efficiency
Process-Oriented Allwin21 Software Control
Embedded industrial computer architecture helps reduce external PC-related instability compared with many older legacy control configurations
Unlike generic software developed only by software programmers, Allwin21 software is developed with real semiconductor equipment and process engineering experience
The software exposes practical equipment and process-related information through integrated monitoring and control architecture, helping equipment engineers and process engineers perform troubleshooting, maintenance, process development, optimization, and equipment status review more efficiently
Decades of Installed Base & Customer Applications
Production-proven plasma chamber technology inherited from historically accepted semiconductor platforms, together with modernized Allwin21 systems, has been widely used in semiconductor fabs, universities, and research institutes for decades
Customers benefit from lower adoption risk because the process platform and chamber behavior are already widely accepted and understood in real semiconductor applications
The accepted process platform helps customers move faster from installation and acceptance into real process development, optimization, and production operation
Not Sure Which Plasma Asher Fits Your Application?
Send wafer size, material, resist type, process target, uniformity requirement,
throughput target, and RF sensitivity for recommendation.
Additional Plasma Asher / Descum Keywords
Plasma Asher, Plasma Descum, Barrel Plasma Asher, Downstream Plasma Asher,
Photoresist Removal, Semiconductor Cleaning, Low Damage Plasma Cleaning,
MEMS Release, Oxide Removal, Nitride Removal, Polymer Ashing,
Gasonics Aura, Branson IPC, Matrix 105, System One Stripper,
Dry Plasma Systems, Semiconductor Strip Equipment, Wafer Cleaning Equipment