Archive | Plasma Asher Descum Equipment

Allwin21 Corp. has been focusing on providing solutions and enhancements to  plasma asher descum semiconductor process. These OEM asher descum semiconductor equipment have been used in production and R&D since 1990′s. They have been Process-Proven. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC, solid 3-axis robotic wafer transfer system, and new critical components to achieve the goal of giving our customers a production edge.

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    AW-105R Plasma Asher

    AW-105R Plasma Stripper Asher . Wafer Size: 3-6.25 inch. 1-4 gas lines with MFCs. 60-200C Temperature with CLTC control . Anodized Chuck with Element heating and chiller cooling. Stand Alone. Integrated solid robotic wafer transfer. Single Wafer Process. Suitable for high uniformity, repeatability processes.
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    AW-1008 Plasma Stripper/Asher

    AW-1008 Plasma Stripper Asher . Wafer Size: 3-6 inch. 1-4 gas lines with MFCs. 100-200C Temperature without control and 200-350C with CLTC. IR Lamp Heating. Stand Alone. Integrated solid robotic wafer transfer. Single Wafer Process. Suitable for high temperature, quick stripper processes.
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