AccuThermo AW1230R 12-Inch R&D RTP System
High-Level 12-Inch RTP for Advanced R&D
12-Inch Automatic RTP Platform for Advanced Research, Process Development, and Pilot-Line
R&D-Oriented 12-Inch RTP Platform
Built on decades of Allwin21 RTP application experience and configured for advanced 12-inch wafer R&D, process development, and pilot-line evaluation.
Customer Gets:
A practical 12-inch RTP development platform without the cost and complexity of a full high-volume production RTP tool.
Large-Wafer Research Hardware
Large-wafer RTP chamber architecture, isolated quartz process tube, pyrometer control, and automatic wafer handling designed for advanced research and process-development work.
Customer Gets:
Better process flexibility, easier maintenance, and a more suitable platform for 12-inch R&D applications.
Flexible RTP Process Control
RTAPRO software supports PowerSum monitoring, lamp intensity limiting, zone tuning, and real-time thermal control.
Customer Gets:
Better process visibility, easier recipe development, and stronger support for high-value 12-inch research wafers.
The AW1230R is a high-level 12-inch automatic RTP platform designed for advanced R&D, process development, university laboratories, research institutes, and pilot-line evaluation. The system is focused on process flexibility, engineering development, and advanced thermal research applications rather than high-volume 12-inch semiconductor mass production.
The Allwin21 AccuThermo RTP platform is based on a field-proven rapid thermal processing architecture with more than 45 years of RTP technology heritage and worldwide use in semiconductor fabs, universities, research institutes, and advanced thermal process-development environments.
Its value is not only the large installed base and long application history, but also the accumulated process knowledge developed through decades of real semiconductor thermal processing experience across many different substrates, applications, process conditions, and research, development, and application requirements.
Through long-term worldwide RTP applications, continuous engineering improvements, real production feedback, and practical process experience, the platform has evolved into a stable RTP system platform designed for repeatability, serviceability, process flexibility, and long-term research use.
Allwin21 continues this proven RTP platform with modern PC-based architecture, proprietary RTAPRO software, real-time lamp power control, PowerSum monitoring, lamp intensity limiting control, automatic wafer-handling architecture, and worldwide engineering support for advanced RTP applications.
1. Proven RTP Hardware Foundation for 12-Inch R&D
Aluminum chamber structure, diffuse gold-coated chamber reflector architecture, optimized cooling-water paths, isolated quartz tube design, pyrometer integration, IR lamp layout, quartz tray, susceptor options, and automatic RTP chamber architecture are based on decades of RTP application history and adapted for high-level 12-inch R&D use.
Customer Gets:
- Lower technology risk
- Proven thermal architecture
- Stable RTP platform for advanced R&D
2. Modernized 12-Inch R&D RTP Hardware
Allwin21 improvements include SSR lamp control, embedded industrial control computer, automatic wafer handling control, pyrometer-based process control, 1–6 gas lines with MFCs and shut-off valves, larger standalone chassis design, CDA idle shutoff, and optional individual water-flow monitoring for each cooling-water circuit.
The AW1230R platform is especially suitable for research centers, universities, advanced materials laboratories, and pilot-line environments requiring 12-inch automatic wafer handling, flexible process development, and repeatable single-wafer RTP operation without purchasing a full high-volume production RTP platform.
Customer Gets:
- Better serviceability
- More flexible process development
- Improved reliability and easier maintenance
- Automatic single-wafer RTP capability for 12-inch R&D operation
3. Process-Development-Oriented RTP Software
The Allwin21 RTAPRO software architecture was originally developed by semiconductor process engineers with practical RTP process-development experience dating back to the 1980s.
Unlike many RTP systems focused mainly on machine operation, RTAPRO was designed to help process engineers and equipment engineers better understand RTP process behavior, thermal transitions, lamp response, process drift, and long-term equipment stability during real process development, research operation, and pilot-line evaluation.
Many RTP process variables, I/O conditions, analog signals, lamp behavior, PowerSum response, and system-status information are directly visible through the software architecture, helping engineers identify process instability or equipment-related changes more efficiently.
Customer Gets:
- Better process visibility
- Easier troubleshooting
- Faster process optimization
- Improved long-term RTP process control
4. Decades of RTP Application Experience
Allwin21 AccuThermo RTP systems have been used worldwide in universities, research institutes, and semiconductor fabs. The AW1230R extends this RTP experience into 12-inch R&D and pilot-line applications, while Allwin21 continues to support RTP users with parts, upgrades, application discussion, installation, and engineering service.
Customer Gets:
- Experienced RTP support
- Practical 12-inch RTP configuration guidance
- Long-term serviceability
Process Results vs. Temperature Uniformity
For RTP applications, direct TC temperature uniformity alone may not represent final process performance. Sheet resistance, film thickness, contact resistance, SEM results, and repeatability often provide more meaningful process evaluation.
Customer Gets:
- Better acceptance criteria
- Less confusion during process development
- More practical RTP evaluation
Atmospheric RTP vs. Vacuum RTP
Many RTP applications do not require vacuum RTP. For many processes, thermal repeatability, gas purity, O₂ / moisture control, chamber design, and process understanding are more important than vacuum level alone. Vacuum RTP systems may also introduce additional contamination sources, increased maintenance complexity, and reduced process repeatability at high temperatures due to chamber structure and cooling requirements.
Customer Gets:
- Avoid unnecessary complexity
- Better model selection
- Practical RTP configuration guidance
Cooling Water Stability
Closed-loop cooling water is recommended for stable RTP chamber cooling and long-term reliability. Because RTP is a high-temperature thermal processing system, a dedicated cooling-water loop is recommended whenever possible. Distilled water is recommended instead of D.I. water for chamber cooling.
Customer Gets:
- Reduced corrosion risk
- More stable chamber behavior
- Better long-term equipment reliability
Susceptor Selection
The appropriate susceptor depends on budget, substrate size, material, thickness, emissivity, wafer bow, backside surface condition, ramp-rate requirements, patterned surface condition, process temperature, throughput, and application requirements. Susceptor size and configuration can also affect achievable ramp rates, thermal repeatability, and process flexibility. Susceptor base or susceptor base + lid configurations may be recommended depending on process sensitivity and wafer surface conditions.
Customer Gets:
- Better process and budget matching
- Reduced wafer handling risk
- Improved thermal repeatability potential
- More suitable RTP configuration for application-specific process needs
| Item | AW1230R Specification |
|---|---|
| Ramp-Up Rate | Programmable from 1°C to 250°C/sec.More detailsActual ramp-up rate depends on process application, wafer size, substrate material, wafer carrier configuration, process temperature, and RTP configuration.
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| Steady-State Temperature | Typical steady-state range: 400°C to 1150°C. Maximum 1250°C.More detailsAW1230R standard configuration uses non-contact pyrometer temperature measurement optimized for most RTP applications. Optional thermocouple temperature measurement configuration may also be reviewed for selected lower-temperature RTP applications below approximately 400°C depending on process requirements and final system configuration.
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| Steady-State Duration | 0 to 9999 seconds per recipe step.More detailsTypical RTP applications use approximately 1 to 600 seconds per recipe step. Actual process duration depends on process temperature, substrate type, process gas, recipe requirements, and automatic wafer handling sequence.
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| Ramp-Down Rate | 1°C to 200°C/sec. Programmable within natural cooling capability.More detailsActual cooling rate depends on process temperature, wafer size, substrate material, wafer carrier configuration, and RTP process conditions. Cooling is typically faster at higher temperatures and gradually decreases at lower temperatures.
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| Temperature Accuracy | Typical pyrometer measurement accuracy: approximately ±2°C with Pyrometer.More detailsActual pyrometer temperature measurement accuracy and repeatability depend on substrate emissivity, wafer backside condition, process temperature, pyrometer calibration condition, chamber configuration, process recipe, and overall RTP process stability.
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| Temperature Repeatability | Typical wafer-to-wafer repeatability: approximately ±3°C under controlled conditions.More detailsBased on wafer-to-wafer repeatability test under controlled process conditions. Actual repeatability depends on substrate, fixture, sensor configuration, process recipe, and facility stability.
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| Temperature Uniformity | ±8°C across an 8″ / 200 mm wafer at 1150°C.More detailsBased on one-sigma deviation from 100 Å oxide uniformity measurements. RTP performance is application dependent and should be confirmed by final process requirements and acceptance criteria.
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| Process / Purge Gases | Supports common RTP process and purge gases.More detailsTypical gases include N₂, O₂, Ar, He, forming gas, NH₃, and N₂O. Process gases should be regulated to 30 PSIG and pre-filtered to 1 micron.
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| Item | AW1230R Standard Configuration |
|---|---|
| System Type | Automatic single-wafer RTP / RTA / RTO / RTN system for production fab automation. |
| Wafer Size Capability | Primarily configured for 12-inch / 300 mm wafer RTP applications.More detailsSelected 8-inch / 200 mm wafer configurations may also be reviewed depending on cassette, robot end-effector, quartz tray, wafer carrier, and automation configuration.
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| Wafer Handling System | Automatic cassette-based robotic wafer transfer into the RTP process chamber.More detailsThe AW1230R uses an integrated robotic wafer handling architecture designed mainly for 12-inch / 300 mm wafer process development, pilot-line, and advanced research RTP applications. The standard configuration may include cassette station, robot transfer mechanism, and application-specific quartz tray configurations. Selected 8-inch wafer handling configurations may also be reviewed depending on application requirements and final system configuration.
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| Metal Chamber Assembly | Standard AW1230R RTP chamber with crossing lamp architecture, double O-ring chamber sealing, and 28 high-intensity infrared lamps with 10 independent control zones.More detailsIncludes top and bottom high-intensity infrared lamp heating, diffuse gold-coated reflector architecture, isolated quartz process tube design, and independent 10-zone lamp-bank control with recipe-level lamp factor adjustment. The crossing lamp structure provides improved thermal tuning capability for automatic RTP applications and sensitive compound semiconductor processes. The standard double O-ring chamber sealing structure provides additional O₂ protection capability for oxygen-sensitive RTP applications.
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| Chassis Assembly | AW1230R automated RTP chassis with embedded industrial computer and automation control architecture.More detailsIncludes automated RTP main frame, embedded industrial control computer for reduced ESD risk, integrated robotic wafer handling control architecture, cassette station, touchscreen monitor, EMO, exhaust cooling fans, main control electronics, AC/DC power supplies, gas control assembly with MFCs, cooling water and CDA gauges, meters, valves, and switches. Additional safety and monitoring features may include water leak sensors, input and return cooling-water pressure meters, bypass cooling-water line, and application-dependent system monitoring configurations for improved long-term reliability and serviceability.
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| Standard Isolated Quartz Tube | Standard isolated quartz tube included.More detailsIsolated quartz tube design optimized for a wide range of RTP applications and contamination control.
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| Standard Quartz Trays | Standard quartz trays available for 12” silicon wafer RTP applications.More detailsThe AW1230R platform is mainly designed for 12” silicon wafer RTP process development and advanced R&D applications. Selected quartz tray configurations for 8” wafer applications may also be reviewed depending on system configuration requirements.
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| Temperature Sensor | Non-contact pyrometer included as standard.More detailsAW1230R standard configuration uses non-contact pyrometer temperature measurement for automatic RTP applications from approximately 400°C to 1250°C. Typical pyrometer measurement repeatability may reach approximately ±1°C under controlled process conditions depending on wafer emissivity, substrate surface condition, process temperature, calibration condition, and process configuration. Compared with contact thermocouple measurement, non-contact pyrometer temperature measurement is commonly preferred for automatic production RTP applications because of faster thermal response, reduced contamination risk, reduced sensor-contact issues, and better long-term repeatability potential at higher temperatures.
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| Manuals & Software | USB drive with manuals, software, and schematics included.More detailsIncludes backup software, installation manual, operation manual, service manual, facility connection drawings, and AW1230R schematics.
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| Item | Optional Configuration / Capability |
|---|---|
| K-Type Thermocouple | Optional T-shape K-type thermocouple configuration for selected low-temperature RTP applications.More detailsOptional thin-wire T-shape K-type thermocouple configuration may be reviewed for selected RTP applications, typically below approximately 400°C, depending on process conditions, substrate type, and wafer handling configuration. AW1230R normally uses standard non-contact pyrometer temperature measurement for automatic production RTP applications because non-contact measurement is generally preferred for fast thermal response, repeatability, reduced contamination risk, and long-term stability at higher temperatures. K-type thermocouple measurement remains commonly used for selected lower-temperature RTP applications and process development depending on process goals and customer preference. IMPORTANT: Thermocouple installation, replacement, and handling on automatic RTP systems require proper experience because incorrect handling may damage the thermocouple assembly or affect process repeatability. |
| More Process Gas Lines | Optional additional gas lines with support for up to 6 MFCs.More detailsAdditional process gas lines are available with optional shut-off valves, gas routing configurations, and application-specific gas configurations.
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| Special Wafer Handling | Optional special wafer handling configurations available.More detailsOptional robot end-effector, quartz tray, and wafer handling configurations may be reviewed for selected 8” and 12” wafer applications depending on wafer thickness, wafer bow condition, process temperature, and application requirements. Final handling capability depends on wafer size, substrate condition, process configuration, and RTP application requirements.
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| Application-Specific Wafer Carriers | Application-specific wafer carriers available for selected AW1230R RTP applications.More detailsAW1230R is mainly designed for 12-inch wafer RTP process development and advanced research applications. Special wafer carriers may be designed for selected applications depending on wafer size, carrier material, process temperature, substrate condition, and handling requirements. For example, application-specific carriers may be reviewed when a customer needs to process selected 8-inch wafers in a 12-inch RTP platform configuration. Final carrier design depends on wafer size, process temperature, carrier material, robot handling requirements, and RTP application requirements. |
| Application-Specific Quartz Trays | Standard and custom quartz tray configurations available for selected RTP applications.More detailsCustom quartz tray and wafer handling configurations may be reviewed depending on wafer size, substrate condition, process temperature, and application requirements.
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| Special Quartz Tube Configuration | Optional quartz tube with liner for heavy outgassing applications. |
| O₂ Sensor / Analyzer | Optional O₂ sensor / analyzer for additional process atmosphere monitoring.More detailsAW1230R standard chamber configuration includes double O-ring sealing for improved process protection. For applications requiring additional atmosphere monitoring, an optional O₂ sensor / analyzer can be added depending on final system configuration. This combination provides a two-layer protection concept: mechanical chamber sealing from the standard double O-ring design, plus process atmosphere monitoring from the optional O₂ sensor / analyzer. O₂ monitoring is commonly considered for sensitive compound semiconductor applications, oxygen-sensitive thermal processes, and high-value wafer production where process stability, wafer protection, and risk reduction are important. For many RTP applications, practical process repeatability, gas purity, and stable chamber conditions are often more important than pursuing extremely low oxygen levels alone. |
| Support & Service | Optional spare parts, installation, training, and process support.More detailsWorldwide engineering support, startup assistance, RTP training, process discussion, remote support, and field service are available depending on customer requirements.
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| GEM/SECS Interface | Optional GEM/SECS factory communication interface.More detailsSupports communication with factory automation systems and fab host / MES integration when required.
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| SMIF Wafer Loader Port | Optional SMIF wafer loader port for automated wafer handling integration.More detailsSupports integration with selected SMIF wafer loading systems for automated wafer transfer and factory automation applications. Allwin21 can supply selected SMIF wafer loader configurations, or customer-specified standard SMIF systems may be integrated depending on customer fab standards and configuration requirements. Allwin21 control software can communicate with compatible wafer loading systems through GEM/SECS communication architecture for integrated automatic operation and factory host / MES coordination depending on final configuration.
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| Facility Item | Typical Requirement |
|---|---|
| Electrical | Approx. 150 Amps 208–240 VAC, 60 Hz, 3-phase, 4-wire — North America typical 200 VAC, 50/60 Hz, 3-phase — Japan typical 380–415 VAC, 50 Hz, 3-phase, 5-wire — Europe / China typical Please confirm facility power configuration before order placement. |
| Cooling Water | Closed-loop cooling water recommended Typical flow: 4–6 GPM Typical pressure: 30–40 PSI Recommended temperature: approximately 20°C Typical fitting: 1/2″ tubing Recommended chiller: SMC HRSF080-AN-20 or equivalent industrial closed-loop recirculating chiller |
| Quartz Tube Cooling Gas / CDA | N₂ or CDA Oil-free and water-free gas recommended Typical pressure: 15–30 PSI Typical flow: 10–15 SCFM Typical fitting: 3/8″ tubing |
| Process Gases / Exhaust | N₂ / O₂ / Ar / He / Forming Gas / NH₃ Typical process gas pressure: 10–30 PSI Typical fitting: 1/4″ VCR 4-inch exhaust duct recommended |
| Item | Information |
|---|---|
| AW1230R Equipment Dimensions | 35″ W × 70″ D × 70″ H |
| AW1230R Net Weight | Approximately 800 lbs |
| Shipping Crate Dimensions | 48″ W × 81″ D × 81″ H |
| Shipping Weight | Approximately 1455 lbs |
Please provide as much information as possible in the RTP Survey PDF and email the completed survey to sales@allwin21.com and/or allwin21corp@gmail.com.
The more complete and accurate your responses are, the better we can recommend the most suitable RTP model or configuration for your specific needs, based on our 45+ years of RTP technology heritage and more than 1,500 RTP systems worldwide.
Completing the survey thoroughly helps ensure optimal system performance while avoiding unnecessary options that do not contribute to your application.
- Product photos, specifications, configurations, and descriptions are for general reference only.
- Final configuration, options, specifications, facility requirements, lead time, and delivery schedule shall be confirmed by official Allwin21 quotation and technical documentation.
- Facility requirements depend on actual system configuration, process gases, temperature measurement configuration, automation configuration, and customer process requirements.
- All equipment specifications, configurations, features, dimensions, and related information are subject to change without notice.
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