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RFQ – Sputter Deposition System

    Please help fill in the following Customer Survey Form for suitable Sputtering Deposition Equipment model and configuration for your applications. Appreciate your time. Thank you very much.

    1. Your Name(Required):

    2. Your Email(Required):

    3. Your Company Name(Required):

    4. Company Address:


    5.1 Substrate Sizes(Required):
    small sample1 inch2 inch3 inch4 inch5 inch6 inch6.125 inch6.25 inch8 inch12 inchOthers
    5.2 Moly Pallet Type(Required):,
    Flat without pocketPN 300-600-075 7x6inchPN 300-600-070 8X6inch w/o Notch,PN 300-600-071 8X6inch w/Notch,PN 083-1138-01 7X150mm NotchPN 083-1140-01 7X150MM, ROUND W/NOTCHPN 083-1140-02 7x6inch w/ wide tweezers pockePN 083-1173-01 6x150mm, wide tweezer groovePN 083-1157-01 6X159MMPN 083-1139-01 7X159MM, ROUND W/NOTCHPN 083-1137-01 7 X159mm NotchPN 083-1166-01,7X154MMOthersNot Sure
    6. Substrate Material(Required):
    SiSiCGaAsGaNGaInPInPOthersNot sure
    7. Amount of Gas lines(Required):
    Ar-200 SCCM;Ar-100 SCCM;O2-100 SCCM;N2 -100 SCCM;N2 -10 SCCM;Others;Not sure
    Please specify other gas types and MFC range if you can provide.

    8. Sputter Materials (Required)
    Ag;Al;Al2O3;Au;Cr;CrNx;CrSi2;Cu;Mo;MoSi2;Ni;Nichrome;Pd;Permalloy;Pt; Quartz;Si;Si3N4;Ta;TaNx;Ti;TiNx;Ti/W(10%);W;WNx;Others;Not sure
    9. Sputter Type(Required,Multiple):
    DC MagnetronRF MagnetronRF DiodePulse DC MagnetronOthersNot sure
    10. Cathode Amount(Required, Maximum 4 units of 8 inch Circle and 3 units of Delta,):

    11. Cathode Size and Shape(Required, Delta ( bond-on type as default and bolt-on as option ), 8 inch Circle ):

    12. Etch Function (Required) :

    13. Bias Function (Required):

    14 Co-Sputtering Function (Required):

    15 Reactive Sputter Function (Required):

    If with Reactive Sputter Function, Please provide the following Info:
    (a) What kind of target for reactive sputtering process?

    (b) What is the repeatability and uniformity ?

    (C)Use RF sputtering or DC sputtering?

    (d) What kind of reactive gas to be used? N2 or O2, or both, or both but at different separated steps?

    (e) Do you have any current process for your reactive sputtering? If yes, what kind of condition (gas flow, pressure and power) if you can provide.

    16.1 Turbo Pump for load lock (Required)?:

    16.2 Turbo or Cryo Pump for Chamber (Required)?:

    17 IR Lamp Heating function for Degas in load lock(Required):

    18 Lamp Heating function in reactor chamber(Required. Not recommended. Occupy one cathode port):

    19.1 Maximum DC Power Supply Watts(Required):
    5KW6KW10KWOthersNot sure
    19.2 Maximum Pulse DC Power Supply Watts(Required):
    5KW10KWOthersNot sure
    19.3 Maximum plasma etch function RF Power Supply Watts(Required):
    300W600W1000WOthersNot sure
    19.4 Maximum RF Sputtering RF Power Supply Watts(Required):
    600W1000W2000WOthersNot sure
    20. Did you use any Sputtering Equipment which met your requirements? If yes, pls specify brand and model.

    21. Do you know Perkin-Elmer Sputtering equipment? If yes, pls tell us which model you know.

    22. Approximate budget(Required):
    < USD$ 50K< USD$ 100K< USD$ 120K< USD$ 150K< USD$ 200K< USD$ 250K< USD$ 350K< USD$ 450K< USD$ 550K< USD$ 800KNot sureOthers

    23. Approximate purchasing time (Required):
    <In 1 monthIn 2 monthsIn 3 monthsIn 6 monthsIn 9 monthsIn 12 monthsIn 24 monthsNot sureOthers

    24. Throughput Requirement :
    <R&D only<10 wafers per day<20 wafers per day<30 wafers per day<40 wafers per day<50 wafers per day<100 wafers per day<200 wafers per day<500 wafers per day>500 wafers per dayNot sureOthers

    25. Special Requirements:

    Include Files(Limit:3M File types:PDF|JPG|JEPG):
    Files1 :
    Files2 :
    Files3 :
    Files4 :
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