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Advanced Semiconductor Process Equipment for 2–8 Inch Fabs and Universities

Allwin21 designs, builds, upgrades, and modernizes semiconductor process equipment for 2–8 inch wafer fabs, pilot lines, research institutes, and compound material facilities. Our systems cover rapid thermal processing (RTP), plasma ashing and descum, plasma etching, magnetron sputtering, and thin film metrology.

Built on more than 45 years of accumulated process and equipment engineering experience, Allwin21 enables customers to preserve proven legacy processes while eliminating obsolete electronics, outdated control systems, and unavailable spare parts. Our equipment delivers modern stability, repeatability, uniformity, automation connectivity, and long-term serviceability.

 
 

Production-Proven Solutions for Legacy and Modern Fabs

Many fabs operate on process flows developed and validated decades ago. These processes cannot be changed without requalification, yet the original equipment often suffers from obsolete control boards, outdated meters and gauges, unavailable sensors, aging wafer transfer mechanisms, and limited system visibility. Engineers spend excessive time maintaining tools instead of optimizing yield and throughput.

Allwin21 solves this problem by preserving the original process behavior while replacing obsolete subsystems with modern control electronics, integrated wafer handling, air-cooled RF and DC power supplies, new impedance matching networks, modern sensors, and a unified software platform. The result is equipment that behaves like the legacy tool—but performs with modern stability, repeatability, uniformity, and data transparency.

Why Engineers and Fabs Choose Allwin21

In addition to long-term customers upgrading legacy systems, an increasing number of new customers choose to purchase Allwin21’s new equipment directly. This decision is driven by peer validation. Customers observe that successful fabs in their field are running production on Allwin21-upgraded systems or Allwin21-built new tools.

Some fabs initially purchase low-priced legacy equipment from the market, only to discover that obsolete electronics, unavailable spare parts, and limited control visibility prevent stable production qualification. Others invest in newly built equipment without sufficient process heritage, resulting in extended delays or failed process transfer. In some cases, customers experience high ownership costs and restrictive service models from large suppliers.

Allwin21 provides a balanced alternative: production-proven processes, rapid installation and qualification (often within 1–3 days), professional engineering support, and long-term maintainability—without obsolete components. Customers who adopt Allwin21 systems typically standardize on Allwin21 for future expansions.

Core Equipment Platforms

Legacy Platforms We Upgrade and Modernize

Allwin21 provides upgrade and modernization solutions for legacy platforms originally manufactured by AG Associates, MPT, Matrix, Branson/IPC, Tegal, Lam Research, Gasonics, Perkin-Elmer, MRC, Temescal, PlasmaTherm, Oxford Instruments, and KLA-Tencor M-Gage systems. These manufacturers no longer support many legacy configurations, yet their processes remain widely validated in production.

Plasma Asher, Plasma Descum, Dry Clean, Downstream Plasma, RIE Plasma Etcher, Tegal 901e, Tegal 903e, Matrix 105, Matrix 303, Branson IPC 2000, Gasonics Aura, Lam AutoEtch, Rapid Thermal Processing, RTP, RTA, RTO, AG Associates Heatpulse 610, Minipulse 310, Magnetron Sputtering, PVD, Thin Film Metrology, Sheet Resistance Measurement, KLA Tencor M-Gage, Semiconductor Process Equipment, 2 inch wafer, 4 inch wafer, 6 inch wafer, 8 inch wafer, compound semiconductor, university fab equipment