Asher / Descum Selection and Configuration Form

Please provide the following process requirements and planning information. Based on your application requirements, Allwin21 will recommend a suitable asher model and configuration.

Contact Information

1. Your Name (Required):

2. Your Email (Required):

3. Company Name (Required):

4. Company Address:

Process Requirements

5. Application (Required):
Photoresist StripDescumSurface CleaningPolymer RemovalOtherNot Sure

6. Substrate Material:
SiSiCGaAsGaNGaInPInPOtherNot Sure

7. Substrate Size / Maximum Size (Required):
Small Sample2 inch3 inch4 inch5 inch6 inch8 inchOtherNot Sure

8. Substrate Shape:
RoundSquareRectangularOtherNot Sure

9. Substrate Thickness:
≤200 µm200–1000 µm>1000 µmNot Sure

10. Material to be Removed:
PhotoresistResiduePolymerPolyimideOrganic ContaminationOtherNot Sure

11. Maximum Photoresist Thickness to be Removed (µm):
<1 µm1–3 µm>3 µmNot Sure

12. Process Temperature Requirement (°C):

Minimum Temperature (°C):

Maximum Temperature (°C):

Not Sure

13. Process Gases:
O₂N₂ArForming GasOtherNot Sure

14. Required Removal Rate (µm/min):

15.1 Required Uniformity (%):

15.2 Required Repeatability (%):

16. Current or Previous Plasma Asher System (Manufacturer and Model):

Planning

17. Throughput Requirement:
R&D<5 substrates/day5–10 substrates/day10–20 substrates/day20–50 substrates/day>50 substrates/dayNot Sure

18. Approximate Budget:
< USD $50KUSD $50K–100KUSD $100K–200KUSD $200K–300KUSD $300K–400KUSD $400K–500K> USD $500KNot Sure

19. Approximate Purchase Timeline:
<1 month1–3 months3–6 months6–12 months>12 monthsNot Sure

20. Future Expansion Plan:

Additional Information

21. Please share any additional application details, challenges, previous experience, process concerns, or future plans that may help us better understand your requirements.

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