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Gasonics L3510 Plasma Asher

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Refurbished & Upgraded Gasonics L3510 Plasma Asher

Refurbished Gasonics L3510 Plasma Asher

The Gasonics L3510 is a versatile downstream photoresist removal system designed for clean, low-damage removal of photoresist, polymers, and process residues. Utilizing the production-proven L-Series platform and patented microwave plasma source, the system provides a wide process window and excellent process flexibility for semiconductor manufacturing, universities, and R&D facilities.

Equipment Overview
  • Model: Gasonics L3510
  • OEM: Gasonics
  • Condition: Refurbished and Upgraded
  • Wafer Size: Up to 8 inch capability. Customized.
  • Gases: O2 5SLM, N2 1SLM. Customized.
  • Wafer Transfer: Integrated solid robotic wafer transfer.
  • Cassette Station: Fixed, more stable.
  • Controller: Allwin21 PC with touch screen monitor.
  • Specifications: OEM
  • Valid Time: Subject to prior sale.
Gasonics Aura L3510 with Allwin21 PC Controller Features
  • Platen and lamp heating for process flexibility
  • Maintenance, Manual, Semi Automatic and Full Automatic operation modes
  • Automated calibration of all subsystems
  • Trouble shooting to sub-assembly levels
  • Programmed comprehensive calibration and diagnostic functions
  • Recipe creation for full automatic wafer processing
  • Automatic decline of improper recipes and process data
  • Multi level password protections
  • Storage of multiple recipes and system functions
  • Real-Time process data acquisition, display ,analysis
  • Real-Time graphics user display (GUI)
  • Process Data and Recipe storage on a hard drive
  • Advanced EOP function with SLOPE (optional)
  • GEM/SEC II functions (optional)
  • The robust integrated robotic wafer transfer (Video) instead of the original obsolete Z-bot
  • Fixed wafer cassette station instead of the original elevator.
Specifications for Reference
  • Pressure: 0.5 – >5.0 torr
  • Platen temperature: 100 – 300°C
  • Microwave Power: 0 – 1200 watts at 2.45 GHz/water cooled
  • Lamp utilization: 0 – 100% (1000 watts)
  • Throughput: 45-60wph
  • Within a wafer: ±5% – 10%. Process dependent.
  • Wafer to wafer (average): ±5% – 10% Process dependent.
  • Ash rate: up to 3.5µm/min Process dependent.
  • System matching: ±10%
  • Mobile Ion Concentration: 1^10/cm2size of 1^11/cm2
  • CV Shift: ≤0.1 volt
  • Particle: <0.02cm2size of 0.2µm

Not Sure Which Plasma Asher Fits Your Application?

Send wafer size, material, resist type, process target, uniformity requirement, throughput target, and RF sensitivity for recommendation.

Asher / Descum Selection and Configuration Form
Additional Plasma Asher / Descum Keywords

Plasma Asher, Plasma Descum, Barrel Plasma Asher, Downstream Plasma Asher, Photoresist Removal, Semiconductor Cleaning, Low Damage Plasma Cleaning, MEMS Release, Oxide Removal, Nitride Removal, Polymer Ashing, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics Aura 3000, Gasonics Aura 3010, Gasonics L3510, Gasonics PEP 3510, Gasonics AE 2001, Branson IPC, Matrix 105, System One Stripper, Dry Plasma Systems, Semiconductor Strip Equipment, Wafer Cleaning Equipment