Product Description
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Allwin21 Corp. has been focusing on providing solutions and enhancements toTegal 901e, Tegal 903e, Tegal 901e TTW, Tegal 903e TTW used plasma Etch RIE semiconductor process equipment. These OEM Etch RIE semiconductor equipment have been used in productions and R&D since 1990′s. They have been proven to be a true “work horse”. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC, solid robotic wafer transfer system and new critical components to achieve the goal of giving our customers a production edge with right cost.
Tegal 901e Plasma Etch RIE
Manufacturer:Tegal | Condition:Fully Refurbished&Upgraded By Allwin21 | Wafer Size:3″/4″/5″/6″Capability | Wafer loading: Automatic, Original Belt-Shuttle-Wafer-Transfer OR Allwin21 Solid-Robotic-Wafer-Transfer | Plasma Power:RF,13.56MHz | Type:Parallel/Single Wafer Process/Plasma Etch/RIE/Stand Alone | Etch Materials: Polysilicon, Refractory metal silicides and Nitride | Gas Lines:1~4 lines capability with customized MFCs range
Tegal 903e Plasma Etch RIE
Manufacturer: Tegal | Condition: Fully Refurbished&Upgraded By Allwin21 | Wafer Size: 3″/4″/5″/6″Capability | Wafer loading: Automatic, Original Belt-Shuttle-Wafer-Transfer OR Allwin21 Solid-Robotic-Wafer-Transfer | Plasma Power: RF,13.56MHz | Type: Parallel/Single Wafer Process/Plasma Etch/RIE/Stand Alone | Etch Materials: Silicon Oxide | Gas Lines: 1~4 lines capability with customized MFCs range
Tegal 901e TTW Plasma Etch RIE
Manufacturer:Tegal | Condition:Fully Refurbished&Upgraded By Allwin21 | Wafer Size:3″/4″/5″/6″Capability | Wafer loading: Automatic, Allwin21 Solid-Robotic-Wafer-Transfer | Plasma Power: RF,13.56MHz | Type:Parallel/Single Wafer Process/Plasma Etch/RIE/Through-The-Wall(TTW) | Etch Materials: Polysilicon, Refractory metal silicides and Nitride | Gas Lines:1~4 lines capability with customized MFCs range
Tegal 903e TTW Plasma Etch RIE
Manufacturer: Tegal | Condition: Fully Refurbished&Upgraded By Allwin21 | Wafer Size: 3″/4″/5″/6″Capability | Wafer loading: Automatic, Allwin21 Solid-Robotic-Wafer-Transfer | Plasma Power: RF,13.56MHz | Type: Parallel/Single Wafer Process/Plasma Etch/RIE/Through-The-Wall(TTW) | Etch Materials: Silicon Oxide | Gas Lines: 1~4 lines capability with customized MFCs range
Tegal 901e Tegal 903e Upgrade Kits (Allwin21 Corp.)
The Upgrade kit for Tegal® 901e Tegal® 903e includes an advanced AW-900 System Control with touch screen operator interface or 17″ LCD Monitor , New PC with Allwin21 AW-900 software and new main control board.
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