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Tegal 6510 plasma etcher

Tegal 6510 For: Polysilicon, Tungsten Silicide, Silicon Trench Reactor Type: HRe, up to 2 reactors, small footprint Wafer Sizes (inches): 4-8 Loadlocked

Utilities and Dimension of PE 4400 magnetron sputtering

ByOthers

Utilities and Dimension of PE 4400 magnetron sputtering

Rear-mounted electrical, water, gas and LN2 inlet panel
Power distribution box
Water flow switch panel and manifold
DC or RF power supply: 208VAC, 60Hz, 3phases, 60A, 4 wires
Vacuum system: 208VAC, 60Hz, 3phases, 60A, 5 wires
Cooling Water: 1.8gpm3
Process N2: 60-70 psi
Process Argon: 5-10 psi
CDA: 40-60 psi
Dimension: 65″W x 46″D x 68″H
Weight: 2,288 lbs

…

Plasma etching is a form of plasma processing used to fabricate integrated circuits. It involves a high-speed stream of glow discharge (plasma) of an appropriate gas mixture being shot (in pulses) at a sample. The plasma source, known as etch species, can be either charged (ions) or neutral (atoms and radicals).…

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