AccuThermo AW820V – Vacuum RTP

Manufacturer: Allwin21 Corp.
Condition: New
Wafer Size: Small~8 inch
Type: Stand Alone, Vacuum (Dry Pump or Dry Pump + Turbo Pump).
Temperature: 100~800°C or 450~1250°C . Long time or Higher temperature (Up to 1500C) are available. Pls contact us for detail.

Lamp Zones: 10 from Jan. 2022

Gas Lines: 6 gas lines with 1-5 MFCs. Option.
Chamber Design: Allwin21

RTP Main Customers: Link

Free Fast Quote: Link

Options: Integrated solid robotic wafer transfer ; SMIF (Standard Mechanical Interface) load port transfer. Add Double O Ring and/or O2 Sensor/Analyzer for O2 sensitive applications and saving GaAs, InP, GaN, GaInP, SiC and other valuable compound material wafers .

PowerSum Function: Save valuable compound material wafers.

Allwin21 RTPs PowerSum Save Valuable Compound Wafers



The AccuThermo AW820V are vacuum rapid thermal processing (RTP) systems, which uses high intensity visible radiation to heat single wafers for short process periods of time at precisely controlled temperatures. The process periods are typically 1-600 seconds in duration, although periods of up to 9999 seconds can be selected. These capabilities, combined with the heating chamber’s cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.

AccuThermo AW820V  Vacuum Rapid Thermal Processing System  BASIC SYSTEM CONFIGURATION

  • AW 820V Main Frame with wires.
  • Aluminum chamber with water cooling and top/bottom plates gold plating.
  • Anodized Aluminum Chamber with top and bottom quartz window plates.
  • Oven control board and main control board
  • Bottom and top heating with 27 (1.5 KW ea, TOP 13 lamps, BOTTOM 14 lamps) Radiation heating lamp module with 10 bank zones
    • ZONE1-5, Top, from front to rear
      1.  ZONE( 1 ), TOP ( front )  ( 2 ) lamps
      2.  ZONE( 2 ), TOP (  )  ( 3 ) lamps
      3.  ZONE( 3 ), TOP ( center )  ( 4 ) lamps
      4.  ZONE( 4 ), TOP (  )  ( 3 ) lamps
      5.  ZONE( 5 ), TOP ( rear )  ( 2 ) lamps
    • ZONE6-10, Bottom, from front to rear
      1. ZONE( 6 ), BOTTOM ( front )  ( 2 ) lamps
      2.  ZONE( 7 ), BOTTOM (  )  ( 3 ) lamps
      3.  ZONE( 8 ), BOTTOM ( center )  ( 3 ) lamps
      4.  ZONE( 9 ), BOTTOM (  )  ( 3) lamps
      5.  ZONE( 10 ), BOTTOM ( rear )  ( 2 ) lamps
  • Quartz Tray for 5 to 8 inch or 4 to 6 inch round (or square) wafer
  • 6 gas lines with 1-5 of MFCs with shut-off valves. Option.
  • Computer Board with AW Software, Touch Screen Monitor, Mouse, Standard
  • Keyboard
  • T Shape Quartz with TC and one holder for 100-800°C
  • One USB with original Software backup

AccuThermo AW820V Vacuum Rapid Thermal Processing System SYSTEM SPECIFICATION

 Stand Alone and Manual loading of wafer into the oven
 Single wafer processing.
 Substrate: 2″, 3″, 4″,5″,6″,8″; Square or round; Transparent and Nontransparent
 Ramp up rate: Programmable, 10°C to 150°C per second.
 Recommended steady state duration: 0-600 seconds per step.
 Ramp down rate: Non-Programmable, 10°C to 150°C per second..
 Recommended steady state temperature range: 150°C – 1150°C 
 Vacuum Pressure (Optional): 50 mtorr to 13 Torr or 13 Torr to 760 Torr
 Atmospheric function is optional
 Patented Temperature Sensor temperature accuracy: ±1°C.
 Thermocouple temperature accuracy: ±0.5°C
 Temperature repeatability: ±0.5°C or better at 1150°C
 Temperature uniformity: ±8°C across a 8″ (200mm) wafer at 1150°C
 Process/Purge gas inputs: Any inert and/or non-toxic gas. Typically,N2,O2,Ar,NH3,N2O are used.

AccuThermo AW820V  Vacuum Rapid Thermal Processing System OPTIONS

 Quartz Tray for Square (or round) substrate (5 to 8 inch or 4 to 6 inch)
 Patented Temperature Sensor For 400-1250°C or 400-1500°C
 Susceptor or carrier (Base &Cover or Base or Cover) for transparent, small pieces, metal thin film substrate:
– Materials: Graphite with SiC coating; Sintered SiC; Silica with SiC Coating; Pure Single Crystal Si; Silicon Wafer with pocket
– Size:2″, 3″, 4″,5″,6″,4X2″,3X3″,Customized size.
 Polished Stainless Steel chamber with water cooling.
 With Atmospheric Function
 With pressure control function (50 mtorr to 13 Torr or 13 Torr to 760 Torr)
 Mechanical or Dry vacuum pump
 Turbo pump for High Vacuum Function: Less than 1X10-6 mbar

 

Contact Us for More Information

“>KEYWORDS: Rapid Thermal Process, Rapid Thermal Processing, Rapid Thermal Anneal, Rapid Thermal Annealing, Rapid Thermal Oxidation, Rapid Thermal Nitride, RTA, RTP, RTO, RTN,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, AG210, AG310, AG 410, AG610, AG 610I, AG Associates, Heatpulse 210, Heatpulse 410, Minipulse 310, Heatpulse 610, Heatpulse 610I, AG Heatpulse 410, AG Heatpulse 610, AG Heatpulse 210, AG Minipulse 310, Atmospheric Rapid Thermal Process, Vacuum Rapid Thermal Process, Furnace, Oven, Thermal Furnace, Thermal Process, Thermal Processing,JIPELEC, ag2146,JetClip,JetStar, AST SHS2000, AST STEAG 2800,  ssintegration, Rapid Thermal Oxide,JetFirst ,Mattson, annealsys, heatpulse ,ag 2146,Koyo Thermo Systems,AST STEAG-MATTSON 2800, heat pulse, Solaris, Eclipse ,modularpro, RLA-1000, AG Heatpulse,  rapid thermal processor, Steag AST SHS2000, Solaris 75, Solaris75,STEAG Electronic Systems ,eng-sol, Annealsys, RLA-3000, Engineering Solutions ,Solaris 150, Rapid Thermal Annealer , AS-Master ,modularpro,RTO ,Modular  Process Technology, Solaris150,AS-One,AS-Micro, ADDAX, JetFirst, JetLight, JetStar

, ,