Perkin-Elmer 4400 Sputter

Manufacturer: Allwin21 Corp.
Condition: Fully Refurbished and Upgraded
Wafer Size: Small~6 inch
Wafer loading: Manual, with Load Lock
Cathodes: Circle Shape, 8″ & 4 max
Sputter Methods: DC/RF; Diode/Magnetron
Gas Lines: 1~3 MFCs
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Perkin Elmer 44xx (PDF)


Process Proven for III-V. With an installed base in the thousands, Perkin-Elmer was a leading supplier of sputter deposition equipment for high technology application in 1990’s. The Perkin-Elmer 4400 Sputter Deposition Systems, fully refurbished and upgraded by Allwin21 Corp., were designed for flexibility offering a wide range of operating and process modes. The highest quality construction, components and Allwin21’s new AW-4450 System Control assure reliable operation and an ultra clean vacuum environment to yield consistently reproducible results. Every fully refurbished and upgraded Perkin Elmer sputtering system was supported by years of technological experience and backed by a worldwide sales and service organization dedicated to prompt courteous service.

The original Perkin-Elmer 4400 Sputter Deposition System is a manually-loaded system capable of limited automatic operation, but requiring manual selection of target and sputtering mode. The The Perkin-Elmer 4400 Sputter Deposition Systems  sputtering head is equipped with four (4) 8″ round cathode positions, one (1) of which may be fitted with an in-process heater fixture in place of a target (Mo shields, vane shutter, and full circle shutter.).

All our Perkin-Elmer 4400 Sputter Deposition Systems go through a series of rigorous tests which are documented, standardized, and certified by performance and reliability standards. By strictly following these procedures, the customer receives guaranteed rapid start-up, lifecycle reliability, and proven process performance.

Key Features

  • Process Proven for III-V substrates
  • Non-PLC (Smaller footprint / easy maintenance)
  • 20+ years proven sputter technology
  • New optimum AW-4450 System Control
  • DC 24V for Motors,Actuator,Relay,Solenoid
  • Four 8″, Circular cathodes
  • High throughput operation
  • High Uniformity and Yield
  • DC, RF Sputter, Pulse DC option
  • Magnetron and Diode Sputter option
  • RF Etch and Bias are optional
  • Ultra Clean vacuum system
  • Load lock operation
  • UHV design
  • Flexible for development or production use
  • Full range of substrate sizes and shapes
  • Various pumping and power options
  • Co-sputtering option
  • Reactive Sputtering option

AW-4450 System Controller

  • Maintenance, Manual, Semi Automatic and Full Automatic operation modes
  • Automated calibration of all sub-systems
  • Troubleshoot to sub-assembly levels
  • Programmed comprehensive calibration and diagnostic functions
  • Recipe creation for full automatic wafer processing
  • Automatic decline of improper recipes and process data
  • Multi-level password protection
  • Storage of multiple recipes and system functions
  • Real-Time process data acquisition, display, analysis
  • Real-Time graphics use display
  • Process Data and Recipe storage on a hard drive
  • Easy TC vacuum gauge calibration
  • Positioning Deposition(optional)
  • GEM/SEC II functions (optional)

Screen of Perkin-Elmer 4400 Sputter Desposition System

Screen of Perkin-Elmer 4400 Sputter Deposition System

Approved Processes and Applications of   Perkin-Elmer 4400 Sputter Deposition System

Al+W Cr/SiO2 SiC Ti+Au
InSnO SiO2 Ti/W Ti+Au+Ni
Al2O3 Mo SiO2+O2 Ni/Fe+Cu+SiO2
Ag MoSi2 Si+N2(Si3N4) Ti/W+Au
Au Mo2Si5 Si+N2+B4C Ti/W+Au+Ta
C Mo5Si3 Ta Ti/W+Al/Si
Cr Ni TaC Ti/W+Ni/Cr+Au
Cr/Co Ni/Cr Ta+Au Ti/W+Pt
Cr/Au Ni+Ni/Cr TaSi2 Al+Ti/W+Ag
Cr+Cu Ni/Fe Ta+SiO2 W+Al2O3
Cr/Si Pt Zr Zn
Cr/SiO TiO2 TiO2+Cr ZnO2
Contact Us for More Information

RFQ-Sputtering Deposition Equipment

    Please help fill in the following Customer Survey Form for suitable Sputter Deposition System model and configuration for your applications. Appreciate your time. Thank you very much.

    1. Your Name(Required):

    2. Your Email(Required):

    3. Your Company Name(Required):

    4. Company Address:

    5. Substrate Sizes(Required):
    small sample1 inch2 inch3 inch4 inch5 inch6 inch6.125 inch6.25 inch8 inch12 inchOthers
    6. Substrate Material(Required):
    SiSiCGaAsGaNGaInPInPOthersNot sure
    7. Amount of Gas lines(Required):

    8. Sputter Materials (Required)
    Ag;Al;Al2O3;Au;Cr;CrNx;CrSi2;Cu;Mo;MoSi2;Ni;Nichrome;Pd;Permalloy;Pt; Quartz;Si;Si3N4;Ta;TaNx;Ti;TiNx;Ti/W(10%);W;WNx;Others;Not sure
    9. Sputter Type(Required,Multiple):
    DC MagnetronRF MagnetronDC DiodeRF DiodePulse DCOthersNot sure
    10. Cathode Amount(Required):

    11. Cathode Size and Shape(Required):

    12. Etch Function(Required) :

    13. Bias Function(Required):

    14 Co-sputter Function(Required):

    15 Reactive Sputter Function(Required):

    16 Turbo Pump for load lock(Required):

    17 IR Lamp Heating function for Degas in load lock(Required):

    18 Lamp Heating function in reactor chamber(Required):

    19 Maximum DC Power Watts(Required):

    19 Maximum RF Power Watts(Required):

    20. Did you use any Sputtering Equipment which met your requirements? If yes, pls specify brand and model(Required).

    21. Do you know Perkin-Elmer Sputtering equipment?If yes, pls tell us which model you know(Required).

    22. Special Requirements:

    Enter the characters shown in the image. captcha

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