1. Typical Applications +
- Dopant activation and annealing
- Oxidation and nitridation
- Metal alloying and contact anneal
- Stress relief annealing
- Material research and process development
2. Basic Configuration +
- AccuThermo AW610M chassis
- Embedded industry computer board with Allwin21 software package
- Oven control PCB and gas control PCB inside the chassis
- Atmospheric cold-wall aluminum chamber with gold plating and water-cooled passages
- Top and bottom 21 Ushio infrared lamp heating system
- 6 zones with SSR lamp control architecture
- 6 gas lines with 1 of N2 MFC, 10SLM
- Quartz isolation tube
- Quartz tray for 3–6 inch wafers and/or susceptors
- Thin K-type thermocouple (150–840 °C)
- 1 package of K type TC wire, 5 pieces for spare
3. Options & Configurations +
- 6 gas lines with up to 6 of MFCs
- Graphite susceptor with CVD SiC coating
- Non-contact ERP pyrometer for 450–1250°C
- TC wafers for ERP calibration
- Double O-ring chamber sealing
- GEM / SECS interface
4. AW610M Key Advantages +
- Quality – Reliable, High-Performance Process. Combines AG Associates hardware with Allwin21-developed software featuring real-time control, fuzzy logic, and millisecond-level precision.
- Cost – Total Ownership Value. Competitive purchase price with cost-effective operation. Minimizes ongoing usage, maintenance, and spare parts expenses.
- Delivery – Fast, Flexible, Reliable. Ensures predictable outcomes, optimized process control, and long-term stability for R&D, pilot production, and process development.
5. Hardware Highlights +
- Aluminum Plate Chamber (45 years proven)
- Scattered Gold Plating (45 years proven)
- Upper and Lower Lamps (45 years proven)
- 0.0125-inch Thick Isolated Quartz Tube (45 years proven)
- Isolated Quartz Tube – easy contamination removal
- 6 Lamp Banks with SSR Control (40 years proven)
- 21 Ushio Lamps – 5–20 years lifetime
- Thin K-type Thermocouples for 150–840°C
- Patented Non-contact ERP Pyrometer for 450–1250°C
- Quartz Tray for 2–6″ Round Substrates
- Graphite Susceptor with CVD SiC Coating
- 6 Gas Lines with 1 MFC (Upgradeable to 6)
6. Software Highlights +
- Real-Time Closed-Loop Temperature Control with fuzzy algorithms
- Advanced Pyrometer Calibration with dual calibration datasets
- User-Friendly GUI with role-based access
- Customizable Recipe Parameters for RAMP and Steady phases
- Unique PowerSum Monitoring for process supervision and wafer protection
- Lamp Bank Monitoring and control for uniformity optimization
7. Technical Specifications +
- Wafer sizes: 2″–6″
- Ramp up rate: 10–120°C/sec
- Steady duration: 0–300 sec
- Ramp down: 10–200°C/sec
- Temperature range: 150–1150°C (Max 1250°C)
- ERP Pyrometer accuracy: ±1°C
- Thermocouple accuracy: ±0.5°C
- Temperature repeatability: ±0.5°C wafer-to-wafer
- Temperature uniformity: ±5°C across 6″ wafer
- Process gases: N2, O2, Ar, He, forming gas, NH3, N2O2
8. Why Choosing the Right RTP System Is Critical +
- RTP performance cannot be judged by datasheets alone.
- Many RTP tools lack real process repeatability.
- True RTP performance requires proven technology.
- Vacuum RTP adds complexity without real advantage.
- Used RTP systems carry hidden risks.
- High-end RTP systems are often cost-inefficient.
9. Frequently Asked Questions +
1. How does PowerSum help protect valuable wafers? – PowerSum represents integrated thermal energy and ensures process repeatability.
2. Why atmospheric RTP instead of vacuum RTP? – Atmospheric RTP avoids slow cooling and contamination risks.
3. Can AW610M be used for production? – Yes, for R&D and pilot production with proper configuration.
4. When should a furnace be used instead of RTP? – For long-duration equilibrium-driven processes.
10. Product Video +
