RFQ – Plasma Asher Descum Systems

Allwin21 Corp. has been focusing on providing solutions and enhancements to Matrix , Branson/IPC ,Gasonics used plasma Asher Descum semiconductor process equipment. These OEM semiconductor equipment have been used in productions and R&D since 1990′s. They have been proven to be a true “work horse”. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC , solid robotic wafer transfer system and new critical components to achieve the goal of giving our customers a production edge with right cost.

Please help fill in the following Customer Survey Form for suitable model (AW-105R, Downstream,Single Wafer, Automatic, the most popular ; AW-B3000, Batch, Manual load,low cost ; AW-1008,Single wafter, automatic) and configuration for your applications. Appreciate your time. Thank you very much.

1. Your Name(Required):

2. Your Email(Required):

3. Your Company Name(Required):

4. Company Address:


5. Substrate Sizes(Required):
small sample1 inch2 inch3 inch4 inch5 inch6 inch6.125 inch6.25 inch8 inch12 inchOthers
6. Substrate Material(Required):
SiSiCGaAsGaNGaInPInPOthersNot sure
7. What are the highest and lowest process temperature(Required,°C):

8. What is the Asher rate specification:

9. What are the Asher Uniformity/Repeatability specifications:

10. Amount of Gas lines(Required):
---1 gas line2 gas lines3 gas lines4 gas linesOthersNot sure
11. What are the maximum and minimum RF power watts?

12. Did you use any Plasma Asher Descum Equipment which met your requirements? If yes, pls specify brand and model.

13. Do you know Matrix , Branson/IPC ,Gasonics plasma asher equipment?If yes, pls tell us which model you know.

14. Approximate budget(Required):
< USD$ 50K< USD$ 100K< USD$ 120K< USD$ 150K< USD$ 200K< USD$ 220K< USD$ 250K< USD$ 300K< USD$ 350K< USD$ 400K< USD$ 500K< USD$ 600K< USD$ 700K< USD$ 800K< USD$ 900K< USD$ 1M> USD$ 1MNot sureOthers

15. Approximate purchasing time (Required):
<In 1 monthIn 2 monthsIn 3 monthsIn 6 monthsIn 9 monthsIn 12 monthsIn 24 monthsNot sureOthers

16. Throughput Requirement :
<R&D only<10 wafers per day<20 wafers per day<30 wafers per day<40 wafers per day<50 wafers per day<100 wafers per day<200 wafers per day<500 wafers per day>500 wafers per dayNot sureOthers

17. Special Requirements:

Include Files(Limit:3M File types:PDF|JPG|JEPG):
Files1 :
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