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055-0014-03 Spare Parts

055-0014-03 RF Control Cable, 25M to 25F, 6′

SKU: 055-0014-03 Category: Hot Selling Parts Tag: HS-Branson

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Product Description

Part Number: 055-0014-03

Description: 055-0014-03, RF Control Cable, 25M to 25F, 6′

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Keithley 4200 SCS semiconductor parameter analyzer + Janis ST-500 cryogenic probe station - Keysight B1500A semiconductor parameter analyzer + Cascade Microtech EPS 150 manual probe station - Potentiostat Gamry Reference 600 - Heidelberg µPG 101 Tabletop Micro Pattern Generator - Hot plates - Spinners for resist coating and development - Suss MA6 UV mask aligner - Suss substrate conformable nanoimprint lithography (SCIL) - Trion Phantom 3 reactive ion etcher (RIE-ICP) - Zeiss Axioscope 5 optical microscope - AJA ATC-1300 F Sputtering - AJA ATC-1800 F Sputtering - AJA Orion-8 Sputtering - AnnealSys As-One 100 Rapid thermal processing - ELETTRORAVA PECVD - HOSITRAD PECVD - Resistive and e-beam evaporators - Speciality Coating PDS-2010 Parylene coater - “3 chamber” PECVD - “3 target” home-made sputtering - “Home-made” e-beam evaporator - “Pfeiffer” sputtering - FTIR – Thermo Nicolet 6700 - Luminescence Spectrometer - Perkin Elmer LS55 - Micro Plate Reader - Raman Microscope – Reninshaw Qontor - Spectrometer UV-Vis_NIR – Perkin Elmer Lambda 950 - Spectroscopic Ellipsometer - Horiba-Jobin Yvon - Sun Simulator - SPI 240A - TGA-DSC - STA 449 F3 Jupiter - X-ray diffraction – PANalytical Xpert PRO CHARACTERIZATION 3D Optical Profiler – Zygo Atomic Force Microscope – Bruker Edge Contact Angle Measurement – VCA Optima XE Electrical Test Station Microscope – Nikon LV150 Reflectometer – Filmetrics F20 Spectroscopic Ellipsometer – J.A. 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Technologies F300S Vacuum Oven – YES WET PROCESSING Acid Hoods Critical Point Dryer – Tousimis Automegasamdri – 915B, Series C Ultrasonic and Megasonic Cleaners Characterization 1540XB FIB/SEM Stacks Image 173 Tencor P7 Profilometer Stacks Image 177 1530 SEM Stacks Image 175 Woollam Ellipsometer Stacks Image 179 Leica Stereozoom Stacks Image 183 Zeiss Axioskop Stacks Image 181 Mitutoyo Finescope Stacks Image 197 Lithography Neutronix-Quintel NXQ4006 Mask Aligner Stacks Image 107 Solitec 5110 coater/developer Stacks Image 111 Karl Suss MA6 Mask Aligner Stacks Image 109 CEE 200 spinner Stacks Image 113 Zeiss 1530 e-beam Lithography Stacks Image 117 Yield Engineering YES-3TA HMDS oven Stacks Image 115 Zeiss 1540XB FIB lithography Stacks Image 119 Innopsys Innostamp Stacks Image 121 Deposition Angstrom e-beam Deposition Stacks Image 91 IKO Electroplating Bench Stacks Image 95 Custom e-beam Deposition Stacks Image 93 Filgen Osmium Plasma Coater Stacks Image 97 STS PECVD Stacks Image 101 Edwards Auto500 Sputtering Stacks Image 99 Etching Trion Orion RIE Stacks Image 235 Miscellaneous Grey Lab Spinner Stacks Image 223 Ozone Cleaner Stacks Image 221 Spin Rinse Dryer Stacks Image 219 Dicing Saw Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Matrix 105, Matrix 205, Matrix 303, Matrix 403,Matrix 106,Matrix 104, Matrix 102,Matrix 101, Matrix 10, System One Stripper, Model 105, System One Etcher, model 303, model 403,Matrix 1107, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher, Plasma Asher, Plasma Descum, Dry Clean, Downstream Asher,Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics 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Activation Annealing Furnace,VF-3000H Vertical Furnace for Gate Insulating Film Formation,VF-3000H Vertical Furnace for Gate Insulating Film Formation,RLA-3100-V Lamp Annealing System for Contact Annealing,RLA-3100-V Lamp Annealing System for Contact Annealing,Rapid temperature rise annealing furnace RTP_Table ，RTP_Table type rapid temperature rise annealing furnace，Rapid temperature rise annealing furnace RTP_SA ，RTP ，semi-automatic rapid temperature rise annealing furnace，Rapid temperature rise annealing furnace ，RTP_Auto ，automatic rapid temperature rise annealing furnace，RTP600V，RTP600Z，RTP500Z，RTP500V，RTP500SV，快速退火炉，北京东之星应用物理研究所，快速升溫退火爐，estarlabs，Glovebox+PVD,2D material CVD,LPCVD & furnace,Vacuum Sintering Furnace,RTP,Plasma Doping (PDS),ASHER,Wet bench,Crystal Si solarcell Mgage 200, Mgage 300, M-gage 200, M-gage 300,Sheet Resistant measurement, Metrology, Tencor M-Gage 300,Tencor M-Gage 200, sheet resistance, sheet resistance Measurement, Semiconductor Equipment, Semiconductor metrology Equipment, KLA-Tencor, Tencor, Sonog-age 200, Sono-gage 300, Sonogage200, Sonogage 300, Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450,Perkin-Elmer 4480, Perkin-Elmer 2400, Perkin Elmer 4400, Perkin Elmer 4410, Perkin Elmer 4450,Perkin Elmer 4480, Perkin Elmer 2400, Sputter, Magnetron Sputter, Diode Sputter, DC Sputter, RF Sputter, DC Magnetron Sputter, RF Magnetron Sputter, Co-sputter, Reactive Sputter, MRC, MRC 603, MRC 903, MRC 602, MRC 902, MRC 604, MRC 904, MRC 924, Plasma Etch, Dry Clean, Bias Function, Cathode, Load lock, Degas, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment,, Thin Film, Metal Thin Film, Thin Film Deposition, PVD, Physical Vapor Deposition Singulus,singular, pecvd,Plasma Enhanced Chemical Vapor Deposition, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment Furnace, MRL, MRL 4 Stack,Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment，Eaton Reliance 850，SOLARIS 100,SOLARIS 200,SOLARIS 150,SOLARIS 150UV,surface science integration, ssi-rtp,ecm-usa,Jipelec JetLight,Jipelec JetFirst 100,Jipelec JetFirst 200,Jipelec JetFirst 300,Jipelec JetStar,Annealsys AS-Micro,Annealsys AS-150,Annealsys AS-100,Annealsys AS-One,Annealsys AS-Master,Annealsys AS-Premium,Annealsys Zenith-100, unitemp, Vacuum Solder System , VSS-450-300 ,RTP-100,RTP-100-EP,RTP-100-HV,RTP-100-HV-EP,RTP-150,RTP-150-EP,RTP-150-HV,RTP-200,VPO-300,VPO-300-HV, hot plate HP-220,hot plate , VSS-450-300, RSO-200, RSO-300, RSS-210-S, RSS-160-S, RSS-110-S , ULVAC, Real RTP-100,Real RTP-150,Real RTP-Mini, SJ High Technology Company, ULTECH, Mattson,Helios XP, Helios C200,Millios,Aspen III,Aspen II,Alpine, Plasma Asher, Descum, Clean, Novyka, Selective Etch Systems, Surface Treatment Systems, Interface Treatment Systems, paradigmE, inductively coupled plasma, ICP, SUPREMA, plasma dry strip , Dry Strip, Plasma ETCH,Plasma ETCH,Surface Treatment ,Ultra-Selective Materials Removal, Rapid Thermal Processing, Millisecond Anneal, Steag-AST RTA,Steag,Mattson-Steag, STEAG 100CS,STEAG Electronic Systems,rapid thermal processing , clean process, CVD ,post-CMP-cleaning,AST 3000,STEAMpulse, high-temperature thin and thick oxides, post-dielectric deposition anneals, selective oxidation , low-temperature copper anneals,Poseidon Double Tank Tool, DTT, ritical cleaning , pre-gate oxidation, pre-epi, pre-furnace,RTP, STEAG AST Elektronik,STEAG / MATTSON / AST 100,STEAG / MATTSON / AST 2800,STEAG / MATTSON / AST 2800E, ,STEAG / MATTSON / AST 2900,Spare Parts, STEAG / MATTSON / AST 3000, STEAG / MATTSON / AST 3000 plus,STEAG / MATTSON / AST Atoms, STEAG / MATTSON / AST Helios, STEAG / MATTSON / AST Helios 6000,STEAG / MATTSON / AST SHS 10MA,STEAG / MATTSON / AST SHS 10MA, STEAG / MATTSON / AST SHS 2000,STEAG / MATTSON / AST SHS 2800, STEAG / MATTSON / AST,STEAG / MATTSON / AST SHS 2800E, STEAG / MATTSON / AST SHS 3000,AST Steag Mattson SHS 1000VAC, RTP, Rapid Thermal Processor,JTEKT Thermo Systems,Crystec Technology,RTP/RTA system RLA 1200, RTP/RTA system RLA 3100, RTP/RTA system RLA 3300, Unity 2900, 0.18-micron thermal processing system, Zhengzhou KJ Technology,High Vacuum RTP-Rapid Annealing Furnace,RTP infrared tube heating tube furnace,RTP rapid annealing furnace,Custom RTP tube furnace,1200℃ RTP Annealing Tube Furnace with Slide-able Quartz Tube,Touch screen RTP rapid annealing furnace,900℃ Two Zone IR-Heating RTP Tube Furnace,900℃ RTP tube furnace with multi-channel proton flowmeter control system,1200℃ Crucible Movable Tube Furnace,Compact Atmosphere Controlled RTP Furnace with 4＂ ID Quartz Tube up to 1100ºC,900℃ Max Slideable RTP Tube Furnace,MATTSON AST Steag 2800,MATTSON AST Steag 2900,MATTSON AST Steag 3000,Steag RTP Systems, Steag Heatpulse 610,Applied Materials,Centura DPN HD,Producer Pyra Anneal,Vantage Astra DSA,Vantage RadOx RTP,Vantage Radiance Plus RTP,Steam oxidation,Applied Materials Centura RTP,Producer Pyra Anneal,radical oxidation,millisecond annealing,model-based controller,Vantage Vulcan RTP,SEMATECH Methodologies , 0.25 m Technology Thermal Applications,firstnano,EasyTube 2000,EasyTube 3000,EasyTube 3000EXT,EasyTube 101,EasyTube 6000, EasyTube 6308, Applied Materials Vantage RadiancePlus, AMAT Vantage RadiancePlus,Vantage RadiancePlus, 0.25 pm TECHNOLOGY,Lamp-based,Laser-based,Heater-based,irradiate the surface of the material,Veeco,Mattson Technology,Screen Holdings,AnnealSys,Applied Materials,Kokusai Electric,JTEKT Thermo Systems,Tokyo Electron,Centrotherm,Hitachi Kokusai Electric,Modular Process Technology,Shankar Muthukrishnan,Beyond the 100nm node, single-wafer RTP,single-wafer rapid thermal Processing, sub-100nm device design node,ultra-shallow junction activation and anneal,USJ, silicide contact formation, thermal oxidation STI formation, spike anneal ,spike annealing, within-wafer uniformity, wafer-to-wafer process uniformity, nickel silicide formation,radical-based oxidation process,rapid thermal processing spike anneal,300mm RTP spike anneal process,ramp-up methodologies, rampdown methodologies,Rapid thermal annealing apparatus,RTA furnace,Dai-ichi Kiden,Dai-ichi Kiden RSA, Combustion furnace, High vacuum heating system, Vertical high temperature heating system,Induction heating system(elevating),Ultra high temperature heating system,CreaTec Fischer,Growth Systems,Mini MBE System,LT-STM/AFM,Evaporators,Centrotherm,centrotherm c.HORICOO 300 ,horizontal batch-type system,centrotherm c.HORICOO 200 , field-proven , ultra-versatile tube furnace system ,centrotherm c.VERTICOO , batch-type wafer processing , semiconductor device fabrication, atmospheric processes, LPCVD processes,centrotherm c.ACTIVATOR, high-temperature annealing, high-volume SiC device manufacturing, electrical activation , post implantation annealing ,SiC MOSFET , diode manufacturing,Cost-efficient dopant activation,Annealing of AlN seed layers , Annealing of AlN epitaxial layers,centrotherm c.OXIDATOR , high-temperature oxidation furnace , Rapid Thermal Processing system for silicon and compound semiconductors,c.RAPID 200,fully automatic loading system,centrotherm PECVD,c.PLASMA, c.DIFF,centrotherm highly versatile diffusion,wide band gap,c.CRYSCOO HTA,AP Systems,AP Systems Korea,KORONA RTP-12MP, KORONA RTP-12LPO , KORONA RTP-12LR/LPRR,Seebeck Coefficient / Electric Resistance Measurement System ZEM-3 series，Mini Lamp Annealer MILA-5050， Atmospheric Thermoelectric Module Evaluation System F-PEM，

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055-0014-03 Spare Parts

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