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KEYWORDS: Mgage 200, Mgage 300, M-gage 200, M-gage 300,Sheet Resistant measurement, Metrology, Tencor M-Gage 300,Tencor M-Gage 200, sheet resistance, sheet resistance Measurement, Semiconductor Equipment, Semiconductor metrology Equipment, KLA-Tencor, Tencor Film Thickness Measurement Instrument : Holmarc HORIBA ZEISS KLA Corporation Lasertec Corporation Bruker Otsuka Electronics Nanometrics Incorporated Ellipso Technology Filmetrics JA Woollam Angstrom Sun Technologies Semilab JASCO Inc Park Systems GmbH Avantes StellarNet Inc. Scientific Computing International. KaPatek Sentech Optosky

AWgage-150 Non-Contact Thickness/Resistance

ByMetal Film Metrology

AWgage-150 Non-Contact Thin Film Sheet Resistance Measurement Instrument. 2 to 6 inch wafers. 1mΩ/square to 19,990 Ω/square measurement range capability. Repeatability: 1-6±%.Mapping Function. Touch Screen. PC control

AWgage-200 Non-Contact Thickness/Resistance

ByMetal Film Metrology

AWgage-200 Non-Contact Thin Film Sheet Resistance Measurement Instrument. 3 to 8 inch wafers. 1mΩ/square to 19,990 Ω/square measurement range capability. Repeatability: 1-6±%.Mapping Function. Touch Screen. PC control

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1 loadlock) Oxford 6 Inch ICP March RIE etchers Wet Processing WAFER PRIMING OVEN LAMINAR FLOW PROCESS STATIONS Deposition Small Coater AJA Oxide Sputter System AJA Sputter System (metals) FC2000 Ferrotec Ebeam Evaporator(metals) ICP - CVD Deposition System Nanocarbon Synthesis Facilities Lamda Microwave Plasma CVD system (nanocrystalline diamond deposition) Thermal/PECVD System for Synthesis of CNT and Graphene Seeding Station for UNCD Deposition Metrology SPECTROSCOPIC ELLIPSOMETER SCANNING PROBE MICROSCOPE SURFACE PROFILOMETERS Filmetrics F40-UV OPTICAL MICROSCOPE RESISTIVITY MEASUREMENT SYSTEM SCANNING VIBRATING ELECTRODE SYSTEM VOLTAMMETRY SYSTEM Misc Tools ADT 7200 Dicing Saw Critical Point Dryer Jeol JBX-5500FS Electron Beam Writer Nanonex NX-2004 ABM Mask Aligner Thermionics eBeam Evaporator AJA ATC-2200 Denton Desk II Brewer Cee 200X KRI KDC75 Oxford Instrument Plasmalab System 100 ICP Oxford Instrument Plasmalab System 80 Fume Hoods Allwin AW 410 Ultraviolet Ozone Cleaning System Characterization X-ray Photoelectron Spectroscopy Electron Microprobe Scanning Electron Microscope ICP-MS ICP-OES RAMAN Combustion Elemental Analyzer (CHN) Leica GZ Stereo Microscope Spectroscopic Ellipsometer WYKO NT1100 3-D Profiling System Lithography and NanoImprint Electron Beam Nanolithography System Nanonex NX1000 NanoImprint OAI Mask Aligner Model 800 Thin-film deposition Angstrom Engineering 6-pocket E-Beam Evaporator IntlVac - 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Keithley 4200 SCS semiconductor parameter analyzer + Janis ST-500 cryogenic probe station - Keysight B1500A semiconductor parameter analyzer + Cascade Microtech EPS 150 manual probe station - Potentiostat Gamry Reference 600 - Heidelberg µPG 101 Tabletop Micro Pattern Generator - Hot plates - Spinners for resist coating and development - Suss MA6 UV mask aligner - Suss substrate conformable nanoimprint lithography (SCIL) - Trion Phantom 3 reactive ion etcher (RIE-ICP) - Zeiss Axioscope 5 optical microscope - AJA ATC-1300 F Sputtering - AJA ATC-1800 F Sputtering - AJA Orion-8 Sputtering - AnnealSys As-One 100 Rapid thermal processing - ELETTRORAVA PECVD - HOSITRAD PECVD - Resistive and e-beam evaporators - Speciality Coating PDS-2010 Parylene coater - “3 chamber” PECVD - “3 target” home-made sputtering - “Home-made” e-beam evaporator - “Pfeiffer” sputtering - FTIR – Thermo Nicolet 6700 - Luminescence Spectrometer - Perkin Elmer LS55 - Micro Plate Reader - Raman Microscope – Reninshaw Qontor - Spectrometer UV-Vis_NIR – Perkin Elmer Lambda 950 - Spectroscopic Ellipsometer - Horiba-Jobin Yvon - Sun Simulator - SPI 240A - TGA-DSC - STA 449 F3 Jupiter - X-ray diffraction – PANalytical Xpert PRO CHARACTERIZATION 3D Optical Profiler – Zygo Atomic Force Microscope – Bruker Edge Contact Angle Measurement – VCA Optima XE Electrical Test Station Microscope – Nikon LV150 Reflectometer – Filmetrics F20 Spectroscopic Ellipsometer – J.A. 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Technologies F300S Vacuum Oven – YES WET PROCESSING Acid Hoods Critical Point Dryer – Tousimis Automegasamdri – 915B, Series C Ultrasonic and Megasonic Cleaners Characterization 1540XB FIB/SEM Stacks Image 173 Tencor P7 Profilometer Stacks Image 177 1530 SEM Stacks Image 175 Woollam Ellipsometer Stacks Image 179 Leica Stereozoom Stacks Image 183 Zeiss Axioskop Stacks Image 181 Mitutoyo Finescope Stacks Image 197 Lithography Neutronix-Quintel NXQ4006 Mask Aligner Stacks Image 107 Solitec 5110 coater/developer Stacks Image 111 Karl Suss MA6 Mask Aligner Stacks Image 109 CEE 200 spinner Stacks Image 113 Zeiss 1530 e-beam Lithography Stacks Image 117 Yield Engineering YES-3TA HMDS oven Stacks Image 115 Zeiss 1540XB FIB lithography Stacks Image 119 Innopsys Innostamp Stacks Image 121 Deposition Angstrom e-beam Deposition Stacks Image 91 IKO Electroplating Bench Stacks Image 95 Custom e-beam Deposition Stacks Image 93 Filgen Osmium Plasma Coater Stacks Image 97 STS PECVD Stacks Image 101 Edwards Auto500 Sputtering Stacks Image 99 Etching Trion Orion RIE Stacks Image 235 Miscellaneous Grey Lab Spinner Stacks Image 223 Ozone Cleaner Stacks Image 221 Spin Rinse Dryer Stacks Image 219 Dicing Saw Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Matrix 105, Matrix 205, Matrix 303, Matrix 403,Matrix 106,Matrix 104, Matrix 102,Matrix 101, Matrix 10, System One Stripper, Model 105, System One Etcher, model 303, model 403,Matrix 1107, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher, Plasma Asher, Plasma Descum, Dry Clean, Downstream Asher,Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics 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