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Sputter Selection and Configuration Form

    Sputter Selection and Configuration Form

    Please provide the following process requirements and planning information. Based on your application requirements, Allwin21 will recommend a suitable sputtering system model and configuration.

    Contact Information

    1. Your Name (Required):

    2. Your Email (Required):

    3. Company Name (Required):

    4. Company Address:

    Process Requirements

    5. Deposition Materials (Required):

    6. Substrate Material:

    7. Substrate Size / Maximum Size (Required):

    8. Substrate Thickness:

    9. Film Thickness Requirement (A):

    10. Process Gases and MFC Range:

    11. Base Pressure Requirement( 5x10-7 torr):

    12. Process Pressure Requirement (mtorr):

    13. Required Sputter Rate (A/min):

    14. Required Uniformity (%):

    15. Required Repeatability (%):

    16. Current or Previous Sputtering System (Manufacturer and Model):

    System Configuration Requirements

    17. Sputter Power Type:

    18. Sputter Type:

    19. Cathode Type:

    20. Plasma Etch / Preclean Function:

    21. RF Bias Function:

    22. Load Lock Heating for Degas (200°C):

    23. Reactor Heating Function (300°C):

    24. Reactor High Vacuum Pump Preference:

    25. Load Lock Pump:

    Planning

    26. Throughput Requirement:

    27. Approximate Budget:

    28. Approximate Purchase Timeline:

    29. Future Expansion Plan:

    Additional Information

    30. Please share any additional application details, challenges, previous experience, process concerns, or future plans that may help us better understand your requirements.

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