The Upgrade kit for Branson IPC® 2000, 3000, 4000 includes an advanced AW-B3000 System Control with touch screen operator interface , New PC with Allwin21 AW-B3000 software ,new main control board and new gas lines with MFCs.
Archive | Upgrade Service
Upgrade Kits for Legacy Semiconductor Equipment
Still running an older Matrix, Gasonics, Tegal, Lam, AG Associates, MPT, Perkin-Elmer, MRC, Temescal, or KLA-Tencor system?
Allwin21 upgrades selected legacy semiconductor process tools with new controller hardware, Allwin21 software, modern interface boards, wafer handling upgrades, and replacement of obsolete key modules when required.
Looking for One of These Legacy Systems?
AG Associates / Heatpulse
Heatpulse 310
Heatpulse 410
Heatpulse 610
Modular Process Technology / MPT
MPT RTP-600XP
RTP-800S
RTP-800XP
MPT RTP-3000
Matrix
Matrix 303, 302, 403, 10 Series
Matrix 1104, 1107,1108, 1303, 1307
Gasonics
GasonicsAura 2000LL
GasonicsAE 2000LL
Gasonics Aura 3000
Gasonics Aura 3010
Gasonics L3510
Branson / IPC
4000 Series
Branson/IPC 3000 Series
L3200 Series
Tegal
Tegal 903e
Tegal 900
Tegal 915, Tegal 965
Tegal 981
Tegal 983
Lam Research
Lam Rainbow 4400, 4500, 4600, 4700
Lam Rainbow 4420, 4520, 4620, 4720
PlasmaTherm RIE, ICP, DRIE, PECVD
PlasmaTherm 720
PlasmaTherm 730
PlasmaTherm 740
PlasmaTherm 770
PlasmaTherm 700
Perkin-Elmer, TES
TES PE-4410 Series
PE-4450 Series
4415 Series
2400 Series
KLA-Tencor
Mgage 300
Sonogage 200
Sonogage 300
Oxford PlasmaLab RIE, ICP, PECVD
Oxford PlasmaLab 100
Oxford PlasmaLab 800
Oxford PlasmaLab 80
Oxford PlasmaLab 80 plus
MRC-Materials Research Corp, TES
TES MRC 643
TES MRC 8671
TES MRC 903
TES MRC 923
TES MRC 943
Temescal, TES Sputter, Evaporator
Temescal BJD-1800
TE VCT-1800
Temescal VES 2550
Other Legacy Semiconductor Tools
Legacy RTP / RTA
Legacy Asher
Legacy Etcher
Legacy PVD
Does Any of This Sound Familiar?
Nobody Wants to Touch the Software
The old PC still runs, but nobody is comfortable changing recipes, rebooting the system, or replacing the computer.
More details
Many legacy systems still depend on old operating systems, old interface boards, and software that only one experienced engineer understands. When that engineer leaves, daily operation becomes risky. The tool may still run, but every recipe change or computer problem becomes a production concern.
One Failed Board Can Shut the Tool Down for Months
The equipment is useful, but one obsolete PCB, controller, or power module can stop production.
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Many fabs keep old boards, used parts, repaired parts, and unknown spare parts because the original supply chain is gone. The real issue is not just finding one board. The real issue is long-term supportability.
We Keep Replacing Parts, But the Problem Comes Back
A board is repaired, a sensor is replaced, or a module is swapped — then another problem appears.
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At some point, a legacy tool may be repairable but not truly reliable. Different suppliers may fix different symptoms, but nobody owns the complete tool architecture. A modernization plan can often reduce repeated troubleshooting cycles.
The Robot Drops Wafers
Wafer transfer errors, cassette issues, alignment problems, and fragile wafer handling cause real production pain.
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Legacy wafer handling problems may come from worn mechanics, obsolete electronics, old sensors, old software logic, or a combination of all of them. For automatic single-wafer tools, a solid integrated robotic wafer transfer upgrade can reduce wafer breakage risk and improve long-term reliability.
The Tool Runs Today, But Nobody Trusts It Tomorrow
The system is still valuable, but engineers are never fully confident it will stay stable.
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Intermittent faults are often the most painful problems. The tool may pass a simple test, then fail during production. Engineers need history, trends, signals, and comparison between good runs and bad runs — not just a final alarm message.
Engineers Spend More Time Troubleshooting Than Running Wafers
Production time is lost because engineers are searching for the cause instead of improving the process.
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When the system does not show enough information, troubleshooting becomes guesswork. The question is usually simple: what changed? The hard part is finding when it changed and which signal changed first.
The OEM Stopped Supporting the Tool Years Ago
The chamber still has value, but the original support path is gone.
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Many legacy tools still have useful process hardware, stable chamber behavior, and qualified recipes. The problem is often the controller, electronics, software, wafer handling, or obsolete modules around the chamber.
Every Shutdown Turns Into a Fire Drill
When the tool goes down, the fab starts searching for parts, old notes, old suppliers, and anyone who remembers the system.
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This is why many customers eventually move from repair-only thinking to upgrade planning. The goal is not only to recover from today's failure. The goal is to reduce the chance of the same type of shutdown happening again.
Three Upgrade Levels — Usually Simpler Than Customers Expect
Level 1 — Controller, PCB, and Allwin21 Software Upgrade
Typical scope may include:
Why customers choose this level:
Engineer-Driven Software: what does it really do?
The purpose of Allwin21 software is not just to make a nicer screen. The purpose is to help equipment engineers and process engineers do their daily work faster.
Legacy systems often do not show enough information. Some signals are hidden inside old control boards. Some useful signals were never collected because the old hardware architecture was limited.
Allwin21 upgrades expose more equipment information, including digital I/O, analog signals, temperature information, RF-related information, motion status, recipe information, equipment history, and subsystem status depending on the tool configuration.
Instead of guessing, engineers can compare a good run to a bad run, review stored data, look at trends, and identify what changed. In many support cases, the customer can open the related screen, take photos or screenshots, and send them to Allwin21 engineers for faster troubleshooting.
The signal was often inside the equipment. The upgrade makes it visible, stores it, and turns it into useful engineering information.
Level 2 — Level 1 + Integrated Robotic Wafer Transfer
Typical scope may include:
Why customers choose this level:
Why upgrade wafer handling?
Wafer handling problems are rarely just one mechanical problem. They can involve old robot electronics, sensors, software logic, cassette transfer, alignment, timing, and worn mechanical parts.
A modern integrated wafer transfer upgrade can reduce dependence on obsolete handling modules, improve repeatability, and help protect valuable wafers from unnecessary handling failures.
For fragile substrates and compound semiconductor wafers, better handling is not just convenience. It directly affects wafer loss, downtime, and operator confidence.
Level 3 — Level 1 or Level 2 + Key Subsystem Replacement
Typical scope may include:
Why customers choose this level:
Why replace obsolete subsystems instead of repairing them again?
Sometimes repairing one board or one module is not enough. If RF, matching, gas control, pressure control, temperature control, sensors, or handling modules are all aging, the tool may keep failing in different ways.
Subsystem replacement can reduce the dependence on unknown used parts and questionable repairs. It also gives the software more useful signals to monitor, store, compare, and display.
The goal is to turn a fragile legacy tool into a more supportable production platform.
Usually not. Many customers are surprised how quickly a legacy semiconductor tool can be modernized when the original chamber, facility connections, and qualified process platform can remain in place.
~1 Day
~1 Day
1–2 Days
2–5 Days
Why can many upgrades be completed so quickly?
Many upgrade projects keep the original process chamber, mechanical platform, facility connections, and qualified process history. The upgrade focuses on controller hardware, software, interface boards, wafer handling, and selected obsolete subsystems based on the tool condition and customer requirements.
Most RTP, plasma asher, and plasma etcher upgrades can often be performed at the customer's facility. PVD and more complex systems may require more time. Only a small number of projects require shipment to Allwin21.
The final scope, installation schedule, and expected downtime are defined in the formal quotation after Allwin21 reviews the equipment model, photos, condition, configuration, and customer requirements.
Why So Many Customers Upgrade Instead of Fighting the Same Tool Again
Keep the Process Hardware That Still Works
Stop Blind Troubleshooting
Reduce Obsolete Parts Dependency
Work With Engineers Who Understand Equipment
Upgrade the Old Tool or Buy a New Allwin21 System?
Upgrade Usually Makes Sense When
New Equipment May Make More Sense When
Allwin21 can discuss both paths: upgrade a proven legacy tool when it still makes sense, or help the customer move to a modern Allwin21 platform when the old equipment is no longer the best long-term choice.
Many customers first know Allwin21 through a legacy tool upgrade. Later, when they need new equipment, they already know who understands their process tools.
Request an Upgrade Kit Review
Please complete the Upgrade Kit RFQ survey and send it with equipment photos, nameplate photos, current condition, application, wafer size, process gases, known problems, and your upgrade goal.
Download Upgrade Kit RFQ PDF
Email Sales
Backup email: allwin21corp@gmail.com
Additional Upgrade Kit Keywords and Legacy Equipment References
Semiconductor equipment upgrade kit, legacy semiconductor equipment upgrade, obsolete semiconductor equipment support, controller upgrade, PCB upgrade, software upgrade, Allwin21 software, semiconductor tool modernization, RTP upgrade, RTA upgrade, plasma asher upgrade, plasma descum upgrade, plasma etcher upgrade, RIE upgrade, sputter system upgrade, PVD upgrade, wafer handling upgrade, robotic wafer transfer upgrade, AG Associates Heatpulse, MPT RTP, Matrix asher, Gasonics Aura, Gasonics L3510, Branson IPC, Tegal 901e, Tegal 903e, Lam AutoEtch, Lam Rainbow, Perkin-Elmer sputter, MRC sputter, Temescal, KLA-Tencor Mgage, Sonogage, legacy tool obsolescence, obsolete spare parts, semiconductor equipment downtime, equipment troubleshooting, good run bad run comparison, I/O signal monitoring, analog signal monitoring, equipment history, process stability, tool uptime.
Gasonics Aura 2000 Upgrade
Plasma-Therm 790 720 730 RIE PECVD
Oxford 80+ RIE PECVD
Tegal 915 Tegal 965 Upgrade
The Upgrade kit for Tegal® 915 Tegal 965 includes a New PC Board with Allwin21 software package ,new main control board and cables. The kit is easy to incorporate (plug-and-play) into the original Tegal 915,Tegal 965 Plasma Asher Plasma Etcher systems.…
AG Associates Heatpulse 610i Upgrade
Allwin21 Corp. also provide upgrade kit for original AG Associates Heatpulse 610I for much better performance.
AG Associates Heatpulse 610 Upgrade
Allwin21 Corp.is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processing equipment. Allwin21 is manufacturing the new AccuThermo AW Series Atmospheric Rapid Thermal Processors and Vacuum Rapid Thermal Processors.
AG Associates Heatpulse 410 Upgrade
Allwin21 Corp. also provide upgrade kit for original AG Associates Heatpulse 410 for much better performance. Upgraded AG Heatpulse 410 is a rapid thermal processor which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures
AG Associates Minipulse 310 Upgrade
Allwin21 Corp. also provide upgrade kit for original AG Associates Minipulse 310 for much better performance. AG Minipulse 310 is a rapid thermal processor
AG Associates Heatpulse 210 Upgrade
Allwin21 Corp. also provide upgrade kit for original AG Associates Heatpulse 210 for much better performance. Upgraded AG Heatpulse 210 is a rapid thermal processor which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures.
