Polysilicon
Polysilicon is deposited in a low pressure chemical vapor deposition (LPCVD) reactor. The polysilicon film grows as a product of the pyrolysis of silane (SiH4) gas. A typical reactor temperature for this process is on the order of 600 degrees Centigrade. The polysilicon film is composed of randomly oriented grains, or crystals, of silicon. Polysilicon as deposited has a grain diameter on the order of 0.1 microns; subsequent thermal processing causes the film to recrystalize, with a resultant increase in grain size to as much as 1.0 micron. Impurities present on the wafer surface prior to polysilicon deposition may serve as nucleation sites, producing polysilicon with a dark, grainy appearance. It is possible for these grains to have substantially different etch characteristics from the bulk film; post etch residues can result. The electrical characteristics of polysilicon may be altered by the addition of dopants to the film. Phosphorus is most frequently used. There are three methods of doping polysilicon: in situ doping, diffusion, and ion implantation. The etch rate of phosphorus-doped polysilicon inversely follows the resistivity. Low resistivity material tends to etch more quickly; lightly doped or undoped material more slowly. Successful etching of polysilicon in the plasma etcher requires that the grain structure of the polysilicon be uniform within the film and across the wafer. Doping levels and sheet resistivities need to be consistent. Layers of surface oxide greater than the native oxide thickness are also a concern.
Allwin21 Corp. has been focusing on providing solutions and enhancements to Matrix 105 , Matrix 205, Gasonics Aura 1000 , Gasonics Aura 3010, Gasonics L3510, Branson/IPC 3000, Branson/IPC L3200 used plasma asher descum semiconductor process equipment and Tegal 901e, Tegal 903e, Tegal 901e TTW, Tegal 903e TTW, Lam AutoEtch 490 ,Lam AutoEtch 590, Lam AutoEtch 690, Lam AutoEtch 790, Lam Rainbow 44XX, Lam Rainbow 45XX, Lam Rainbow 46XX, Lam Rainbow 47XX, Matrix 303,Matrix 403 used plasma Etch RIE semiconductor process equipment. These OEM semiconductor equipment have been used in productions and R&D since 1990′s. They have been proven to be a true “work horse”. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC, solid robotic wafer transfer system and new critical components to achieve the goal of giving our customers a production edge with right cost.
Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Stripper Descum, Plasma Etch/RIE, Sputter Deposition high-tech semiconductor equipment, services and technical support in Semiconductor industry, MEMS, Biomedical, Nanotechnology, Solar, LEDs etc. We endeavor to be a leader in our semiconductor equipment product lines. To achieve this, we have been providing unique innovative and cost-effective technical solution, high quality semiconductor equipment and on time spare parts delivery worldwide. We have maintained a global presence that has grown and expanded into the major high-tech manufacturing areas of the world. We pride ourselves on developing and continuing lasting customer and client relationships.
We understand that a timely responsive support and service are critical elements in semiconductor industries. Allwin21 experienced engineer team is the best guaranty for our high quality service and support. We provide on-site installation, training, maintenance, semiconductor equipment optimization, retrofits, customized upgrades.
We continue to be a fast growing company. Our unique ability to provide high performance semiconductor equipment benefits our customers. Our awareness, flexibility, unique quality and innovation are the driving force of our success.
- Allwin21 is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processor semiconductor equipment.
- Advanced AW Series Software for the Rapid Thermal Process, Plasma Asher Stripper Descum,Plasma Etch/RIE, Sputter Deposition semiconductor equipment, which enable new processes, increase yield, improve uptime, reduce maintenance costs, and extend capital equipment.
- Integrated robotic wafer transfer for many single wafer process semiconductor equipment which increases equipment stability sharply.
- The AW software incorporates a Superior Temperature Control Technology (Advanced PID) that surpasses all original manufactures specs and make the semiconductor equipment have much better repeability. The AW software is capable of controlling the temperature of the wafer to ± 1°C. It is also able to control the temperature from wafer to wafer to ± 0.5°C.
- All our semiconductor equipment go through a series of rigorous tests which are documented, standardized, and certified by performance and reliability standards. By strictly following these procedures, the customer receives guaranteed rapid start-up, lifecycle reliability, and proven process performance.
