Process Chamber of AccuSputter AW 4450

 Process Chamber of AccuSputter AW 4450

  • 28″ diameter X 12″ high stainless steel cylinder with 6″ CF flange viewport and load lock port
  • 28″ diameter stainless steel top plate.
  • 28″ diameter stainless steel base plate
  • 11/2” air-operated roughing isolation valve
  • Air-operated gas inlet valve
  • Air-operated vent valve
  • 11/2“blanked-off leak check port
  • Removable deposition shields
  • 23″ diameter, 3-position water-cooled annular substrate table with Feed-thru assembly Table Rotate/Lift Subsystem.
  • Full circle shutter with vane shutter
  • Chain drive pallet carrier transport
  • Heavy duty electric hoist

AccuSputter AW 4450  Series Production Sputter Systems are manufactured in the configuration of a manually-loaded system capable of fully automatic operation. The AccuSputter ® AW 4450 sputtering head is equipped with three DeltaTM cathode or four round 8-inch positions ( Mo flame sprayed shields and shutters standard).The AccuSputter ® AW 4450-Series Production Sputter Systems deposit a wide variety of materials onto substrates such as ceramic, metal, plastics, glass and semiconductors. The system can also be used for RF sputter-etching, a process in which material is removed from, rather than being deposited on, the substrates prior to sputter deposition. These sputtering systems sequentially deposit thin films of up to three or four different materials onto a single substrate, thus attaining sandwich-structured films such as multi-layer optical interference filters or semiconductor devices. Resulting thin films range in thickness from a few Angstroms up to several microns.

AccuSputter AW 4450 Sputter Deposition System