Please contact us if you need Heatpulse 210 manual.
Advanced Upgraded AG Associates Heatpulse 210 RTA RTP performance specification:
- Recommended Steady-State Temperature Range: 100-1100° C.
- Steady-State Temperature Stability: ± 5° C.
- Temperature Monitoring Mechanisms: Pyrometer,used for process temperatures from 600°C to 1100°C or a thermocouple, used for process temperatures below 800°C.
- Heating Rate: 10°C to 80°C for wafer, Programmable.
- Cooling Rate: Temperature dependent; max 150° C per second.
- Maximum Non-uniformity:
- Radiant Flux: ±0.25%
- Sheet resistivity(Post-anneal sheet resistivity measured on a 100mm wafer annealed
- at 1100° C for 10 seconds. R&D models optimized for slip control):
- <3% (Dose Monitoring Units)
- <2% (R&D Units)
- Implant: As 1E16 50 KeV with implant uniformity 0.3%
- Steady state process time 0 to 30000 sec programmable
- Wafer Sizes for the AG210: 2″, 3″, 4″
- Process Gases: The AG 210 system delivers one non-corrosive process gas with manually controlled flow. Up to one MFC is optional.
Please contact us if you need Heatpulse 210 manual.
Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processing equipment. Allwin21 is manufacturing the new AccuThermo AW Series Atmospheric Rapid Thermal Processors and Vacuum Rapid Thermal Processors.Compared with traditional RTP systems, Allwin21″s AccuThermo AW RTPs have innovative software and more advanced temperature control technologies to achieve the best rapid thermal processing performance ( repeatability , uniformity and Stability etc.).
