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Production-Proven Semiconductor Equipment Platforms

Allwin21 provides modernized semiconductor process equipment platforms for research labs, universities, compound semiconductor fabs, pilot production, and manufacturing environments.

Our main product areas include rapid thermal processing, plasma asher / descum, plasma etcher / RIE, sputtering deposition, thin film metrology, and upgrade kits for legacy semiconductor equipment.

The goal is simple: help customers keep proven process platforms productive while reducing obsolete hardware risk, improving operation, and supporting today’s fab requirements.

Why Allwin21 Products

Production-Proven Platforms

Built around accepted semiconductor equipment architectures with real process history.

Modernized Hardware

Updated controls, electronics, subsystems, safety, and serviceability for long-term use.

Process-Driven Software

Control systems designed around repeatability, monitoring, diagnostics, and fab operation.

Lower Adoption Risk

Customers are not starting from random new designs or unproven process concepts.

Product Categories

Rapid Thermal Processing

Production-proven RTP platforms for annealing, oxidation, contact alloy, dopant activation, and compound semiconductor thermal processes.

RTP
Anneal
SiC
GaN
InP
Manual & Automatic

View RTP Category

Plasma Asher / Descum

Low-damage plasma platforms for descum, photoresist removal, residue cleaning, and sensitive semiconductor surface preparation.

Descum
Photoresist Strip
Low RF Damage
Compound Semiconductor
Yellow Area

View Asher Category

Plasma Etcher / RIE

Production-proven dry etch platforms for plasma etching, RIE processes, compound semiconductor research, and production support.

RIE
Dry Etch
Plasma Etch
Process Stability
Modernized Control

View Etch Category

Sputtering Deposition

Thin film deposition platforms for metal films, semiconductor process development, compound semiconductor devices, and production-proven sputter applications.

Sputter
Thin Film
PVD
Metal Deposition
Perkin-Elmer Platforms

View Sputter Category

Thin Film Metrology

Precision film measurement platforms for semiconductor process monitoring, sheet resistance, film characterization, and lab-to-production metrology needs.

Metrology
Film Measurement
Sheet Resistance
Process Monitoring
Cleanroom Table Tools

View Metrology Category

Upgrade Kits

Modern hardware and control upgrade solutions for production-proven semiconductor equipment platforms with obsolete electronics, controls, motion, RF, or interface systems.

Legacy Tool Upgrade
Modern Control
Obsolete Parts
Retrofit
Long-Term Support

View Upgrade Category

Need Help Selecting the Right Equipment?

Equipment Selection Is Not Always Straightforward

Choosing the right semiconductor equipment is not always straightforward. Similar applications can often be supported by different equipment platforms, process approaches, automation levels, and investment budgets.

The Right Solution Depends on the Application

Whether you are evaluating rapid thermal processing (RTP), plasma ashing, plasma etching, sputtering deposition, thin film metrology, or equipment upgrades, the best solution depends on your application objectives, process requirements, throughput expectations, facility conditions, and long-term support needs.

Why Work with Allwin21

With experience supporting universities, research institutes, compound semiconductor fabs, pilot production, and manufacturing environments, Allwin21 can help identify practical equipment solutions based on process requirements, business objectives, and long-term ownership considerations.

AW-105R Plasma Asher

AW-105R Plasma Stripper Asher . Wafer Size: 3-6.25 inch. 1-4 gas lines with MFCs. 60-200C Temperature with CLTC control . Anodized Chuck with Element heating and chiller cooling. Stand Alone. Integrated solid robotic wafer transfer. Single Wafer Process. Suitable for high uniformity, repeatability processes.
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AW-1008 Plasma Stripper/Asher

AW-1008 Plasma Stripper Asher . Wafer Size: 3-6 inch. 1-4 gas lines with MFCs. 100-200C Temperature without control and 200-350C with CLTC. IR Lamp Heating. Stand Alone. Integrated solid robotic wafer transfer. Single Wafer Process. Suitable for high temperature, quick stripper processes.
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