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Configuration of AccuSputter AW 4450


Model	AccuSputter AW 4450
	Delta Cathode Configuration						Circular Cathode Configuration
Basic System	Controller :Allwin21 Corp.’s AW-4450 System Control AccuSputter AW 4450 Frame Power Distribution Box: New, AC380V /208V/ 3Phase Process Chamber Load lock Vacuum Systems for load lock and process chamber
Cathode Size	Delta						8″		6″	5″	4″		3″		2″	14″
Cathode Port Amount	1	2		3			1 to 4				1 to 8					1
Sputter Type	DC Magnetron		RF Magnetron			RF Diode						Pulse DC
DC Power Supplier	1-10KW						1-5KW
RF Power Supplier	1-3KW						1-2KW
Substrate Size	~ 8 inch						~6inch		~4inch	~3inch	~3inch		~2inch		~1inch	~12inch
Wafer Load	Manually load
Throughput per Batch	3/4/5/6/8″ Wafer Size: 30/14/10/8/5 pieces							3/4/5/6″ Wafer Size:30/14/10/8 pieces									12″/1
Sputter Rate	20 to 500 Angstroms/kw-min depending on different model, cathode, process, sputter material etc
Uniformity Capacity	±5%~7%							±7%~10%
Options	* Turbo pump for load lock				* Load lock heating function (200^oC)									* RF Etch
	* Dry pump or mechanical pump				* Process Chamber heating function (360^oC)									* RF Bias

Vacuum Systems for AccuSputter AW 4450

Utilities and Dimension of AccuSputter AW 4450

Semi Membership

hermal annealer, Lindberg furnaces,Plasma therm ICP (deep RIE), Plasma therm PECVD, Plasma term RIE, STS PECVD, PlasMos ellipsometer, Ozone stripper, Alpha step profilometer, Veeco Dektak profilometer, Filmetrics Profilm3D Profilometer Tencor Alpha-Step 200 Profilometer AST VCA Optima XE Zeiss Axiotech Microscope Cascade Probe Station PDMS Alignment Tool 3D Systems Figure 4 3D Printer Motic BA310MET-T Microscope CorSolutions PDMS Port Creator Disco DAD 2H/6T Wafer Dicer Fisher Muffle Furnace Lindberg/Blue M Tube Furnace Blue M Oven Lindberg/Blue M Oven Unitron Z10 Stereo Zoom Microscope Leica Stereo Zoom Microscope Electro-Technic Products BD-20 Corona Treater Harrick PDC-32G Plasma Cleaner PDMS Station Brewer Science Cee 100 PVD Chamber Stratasys Mojo 3D Printer Universal M-25 CO2 LASER Engraver SUSS MicroTec PMC-150 Cryoprober Keysight PNA Network Analyzer N5127B DC-67 GHz Lakeshore CPX Cryogenic Probe Station Zurich Instruments HF2LI Lock-in Amplifier Cascade Microtech Model 9000 Manual RF Probe Station QuikLaze-50 Multi-Wavelength Laser Trimming Station JFP Microtechnic Flip Chip Bonder WestBond 747677E Three-Way Convertible Manual Bonder Cincinnati Sub-Zero MicroClimate Temperature Chamber Zyvex tDriver 1600 Micro-Electro-Mechanical (MEMS) Control Station Lithography Equipment DUV Exposure Station and Aligner MicroWriter ML3 Pro Metrology Equipment Ellipsometer Reflectometer Atomic Force Microscope (AFM) Scanning Electron Microscope (SEM) NIR-UV-VIS Spectrophotometer Measuroscope Optical Microscope Plasma etching (Deep Reactive Ion Etching) Analytic Probe Contact Profilometer Optical Profilometer Processing Equipment Plasma Asher Hot Plate Station Non-vacuum Oven Denton Plasma Coating Xanthos Hood Probestation (Zeus) PE50 O2 Plasma Asher Oxidation Furnace-Wet Teaching Bay Diffusion Furnace (MRL P-Type) Teaching Bay Diffusion Furnace (MRL N-Type) Hydra Wet Hood Chimera Wet Hood Wafer Bonder 3-Zone Tube Furnace Ebeam Evaporator RTP Oxford ICP/RIE Back-End Processing Critial Point Dryer Lapping and Polishing Tool LatticeGear Scribing Tools MA 1006 Dicing Saw Chemical Vapor Deposition EasyTube Diffusion Furnace Fiji Plasma ALD GSI 2000 PECVD SSI Solaris RTA Etching AutoGlow 200 Plasma Cleaner Oxford 100 ICP RIE Oxford 80+ ICP RIE Oxford Cryo Bosch DRIE XeF2 Silicon Etcher Lithography EVG 620 Mask Aligner Heidelberg DWL-66 Laser Mask Writer Laurell Spinners YES HDMS Prime Ovens Metrology Filmetrics F54-UV Reflectometer Four Point Probe Station KLA P-7 Stylus Profiler Olympus BH-2 Optical Microscope Woollam Ellipsometer Zeta-20 Optical Profiler Sputtering and Evaporation Denton E-Beam Evaporator KJL Sputterer Nano38 Thermal Evaporator PETE E-Beam Evaporator PECVD PEALD AJA Magnetron Sputter SuSS MJB4 Contact Aligner Vacuum Oven Chemical Hoods Deposition Equipment E-Beam Evaporator Lithographic Tools LaserWriter.jpg UV Mask Aligner (front side and front to back) Laser Writer MLA Interferometric Lithography System 100KV Electron Beam Lithography System (JEOL 9100 FS) Raith 30KV Electron Beam Lithography System Focused Ion Beam System Plasma and Reactive Ion Etching Oxford ICP etching system (2 chambers - 1 loadlock) Oxford 6 Inch ICP March RIE etchers Wet Processing WAFER PRIMING OVEN LAMINAR FLOW PROCESS STATIONS Deposition Small Coater AJA Oxide Sputter System AJA Sputter System (metals) FC2000 Ferrotec Ebeam Evaporator(metals) ICP - CVD Deposition System Nanocarbon Synthesis Facilities Lamda Microwave Plasma CVD system (nanocrystalline diamond deposition) Thermal/PECVD System for Synthesis of CNT and Graphene Seeding Station for UNCD Deposition Metrology SPECTROSCOPIC ELLIPSOMETER SCANNING PROBE MICROSCOPE SURFACE PROFILOMETERS Filmetrics F40-UV OPTICAL MICROSCOPE RESISTIVITY MEASUREMENT SYSTEM SCANNING VIBRATING ELECTRODE SYSTEM VOLTAMMETRY SYSTEM Misc Tools ADT 7200 Dicing Saw Critical Point Dryer Jeol JBX-5500FS Electron Beam Writer Nanonex NX-2004 ABM Mask Aligner Thermionics eBeam Evaporator AJA ATC-2200 Denton Desk II Brewer Cee 200X KRI KDC75 Oxford Instrument Plasmalab System 100 ICP Oxford Instrument Plasmalab System 80 Fume Hoods Allwin AW 410 Ultraviolet Ozone Cleaning System Characterization X-ray Photoelectron Spectroscopy Electron Microprobe Scanning Electron Microscope ICP-MS ICP-OES RAMAN Combustion Elemental Analyzer (CHN) Leica GZ Stereo Microscope Spectroscopic Ellipsometer WYKO NT1100 3-D Profiling System Lithography and NanoImprint Electron Beam Nanolithography System Nanonex NX1000 NanoImprint OAI Mask Aligner Model 800 Thin-film deposition Angstrom Engineering 6-pocket E-Beam Evaporator IntlVac - Nanochrom I Sputterer Oxford Instruments - Atomic Layer Deposition (ALD) System - OpAL Nanonex_Ultra Plasma etching Oxford Instruments - RIE-ICP PlasmaPro 100 Cobra Oxford Instruments RIE NGP80 Sample Preparation VWR Vacuum Oven - AFM - Asylum MFP3D - Confocal Laser Scanning Microscope – Zeiss LSM 700 - Contact angle - Dataphysics OCA15plus - Dynamic Light Scattering (DLS) – AvidNano W130i - Optical Microscope – Olympus BX51 - Optical Stereo Microscope - Leica M80 - Scanning Electron Microscopy Focused Ion Beam (SEM-FIB) workstation - Tabletop microscope TM3030 Plus Hitachi - Drying oven - Electro-optical bench - Glove Box - Heated vacuum desiccator - Langmuir–Blodgett - NMR Spectrometer - Precision Balance - Rotovapor - UV/Vis Spectrophotometer - Agilent 4155C semiconductor parameter analyzer + Cascade Microtech M150 manual probe station - Agilent 4155C semiconductor parameter analyzer + Everbeing C-2 Mini manual probe station - Biorad/Nanometrics HL5500 Hall effect systems - Jandel Four point prober - Keithley 4200 SCS semiconductor parameter analyzer + Janis ST-500 cryogenic probe station - Keysight B1500A semiconductor parameter analyzer + Cascade Microtech EPS 150 manual probe station - Potentiostat Gamry Reference 600 - Heidelberg µPG 101 Tabletop Micro Pattern Generator - Hot plates - Spinners for resist coating and development - Suss MA6 UV mask aligner - Suss substrate conformable nanoimprint lithography (SCIL) - Trion Phantom 3 reactive ion etcher (RIE-ICP) - Zeiss Axioscope 5 optical microscope - AJA ATC-1300 F Sputtering - AJA ATC-1800 F Sputtering - AJA Orion-8 Sputtering - AnnealSys As-One 100 Rapid thermal processing - ELETTRORAVA PECVD - HOSITRAD PECVD - Resistive and e-beam evaporators - Speciality Coating PDS-2010 Parylene coater - “3 chamber” PECVD - “3 target” home-made sputtering - “Home-made” e-beam evaporator - “Pfeiffer” sputtering - FTIR – Thermo Nicolet 6700 - Luminescence Spectrometer - Perkin Elmer LS55 - Micro Plate Reader - Raman Microscope – Reninshaw Qontor - Spectrometer UV-Vis_NIR – Perkin Elmer Lambda 950 - Spectroscopic Ellipsometer - Horiba-Jobin Yvon - Sun Simulator - SPI 240A - TGA-DSC - STA 449 F3 Jupiter - X-ray diffraction – PANalytical Xpert PRO CHARACTERIZATION 3D Optical Profiler – Zygo Atomic Force Microscope – Bruker Edge Contact Angle Measurement – VCA Optima XE Electrical Test Station Microscope – Nikon LV150 Reflectometer – Filmetrics F20 Spectroscopic Ellipsometer – J.A. Woollam alpha-SE Stylus Profilometer – Veeco Dektak-8 DEPOSITION Atomic Layer Deposition – Arradiance GEMStar XT-P E-beam Evaporator – AJA Parylene Coater – SCS Labcoter2 Parylene Deposition System Plasma Enhanced Chemical Vapor Deposition (PECVD) – STS LpX CVD Sputter I – AJA Orion Sputter II – AJA Orion Thermal Evaporator – Denton Vacuum Explorer 14 ETCHING – ASHING Deep Reactive Ion Etcher (DRIE) – STS LpX Pegasus Plasma Cleaner – Samco PC-300 Reactive Ion Etcher (RIE) – Samco RIE-10NR Xenon Difluoride Etcher – Xactix FURNACES Furnace – Tystar Rapid Thermal Processor – AW-610 PACKAGING Laser Cutter – LPKF ProtoLaser R Wire Bonder -Ball- iBond5000 Wire Bonder – Wedge – West Bond 747677E PHOTOLITHOGRAPHY Convection Ovens – Blue M DCC-146-C-ST350 Develop Hood Mask Aligner – Suss MABA6 Mask Aligner – Suss MJB4 Maskless Aligner – Heidelberg MLA150 Maskless Aligner – Heidelberg uPG501 Microscope – Nikon LV150 Polyimide/SU8 Hood Spinner Hood Ultraviolet Flood Exposure System – Inpro Technologies F300S Vacuum Oven – YES WET PROCESSING Acid Hoods Critical Point Dryer – Tousimis Automegasamdri – 915B, Series C Ultrasonic and Megasonic Cleaners Characterization 1540XB FIB/SEM Stacks Image 173 Tencor P7 Profilometer Stacks Image 177 1530 SEM Stacks Image 175 Woollam Ellipsometer Stacks Image 179 Leica Stereozoom Stacks Image 183 Zeiss Axioskop Stacks Image 181 Mitutoyo Finescope Stacks Image 197 Lithography Neutronix-Quintel NXQ4006 Mask Aligner Stacks Image 107 Solitec 5110 coater/developer Stacks Image 111 Karl Suss MA6 Mask Aligner Stacks Image 109 CEE 200 spinner Stacks Image 113 Zeiss 1530 e-beam Lithography Stacks Image 117 Yield Engineering YES-3TA HMDS oven Stacks Image 115 Zeiss 1540XB FIB lithography Stacks Image 119 Innopsys Innostamp Stacks Image 121 Deposition Angstrom e-beam Deposition Stacks Image 91 IKO Electroplating Bench Stacks Image 95 Custom e-beam Deposition Stacks Image 93 Filgen Osmium Plasma Coater Stacks Image 97 STS PECVD Stacks Image 101 Edwards Auto500 Sputtering Stacks Image 99 Etching Trion Orion RIE Stacks Image 235 Miscellaneous Grey Lab Spinner Stacks Image 223 Ozone Cleaner Stacks Image 221 Spin Rinse Dryer Stacks Image 219 Dicing Saw Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Matrix 105, Matrix 205, Matrix 303, Matrix 403,Matrix 106,Matrix 104, Matrix 102,Matrix 101, Matrix 10, System One Stripper, Model 105, System One Etcher, model 303, model 403,Matrix 1107, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher, Plasma Asher, Plasma Descum, Dry Clean, Downstream Asher,Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics Aura 3000, Gasonics L3510, Gasonics Aura 3010, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean,Gasonics AE 2001, Gasonics AE 2000LL Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Plasma RIE ,Reactive Ion Etch System, Reactive Ion Etch System, Tegal 901e, Tegal 903e, Tegal 901e TTW, Tegal 915,Tegal 701,Tegal 703,Tegal 801,Tegal 803,Tegal 981e,Tegal 903e,Tegal 915, Tegal 965, Tegal 405, Tegal 401 Plasma Etcher, Please Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Lam AutoEtch 490, Lam AutoEtch 590, Lam AutoEtch 690, Lam AutoEtch 790, Lam Rainbow 4400, Lam Rainbow 4420, Lam Rainbow 4428, Lam Rainbow 4500, Lam Rainbow 4520, Lam Rainbow 4528, Lam Rainbow 4600, Lam Rainbow 4620, Lam Rainbow 4628, Lam Rainbow 4700, Lam Rainbow 4720, Lam Rainbow 4728, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics AE 2001, Microwave Etcher, Microwave Plasma Etcher, Microwave Etch, Downstream Plasma Etch Rapid Thermal Process, Modular Process Technology, Rapid Thermal Processing, Rapid Thermal Anneal, Rapid Thermal Annealing, Rapid Thermal Oxidation, Rapid Thermal Nitride, RTA, RTP, RTO, RTN,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, AG210, AG310, AG 410, AG610, AG 610I, AG Associates, Heatpulse 210, Heatpulse 410, Minipulse 310, Heatpulse 610, Heatpulse 610I, AG Heatpulse 410, AG Heatpulse 610, AG Heatpulse 210, AG Minipulse 310, 4100 , 4100S 4108, 8108 ,Atmospheric Rapid Thermal Process, Vacuum Rapid Thermal Process, Furnace, Oven, Thermal Furnace, Thermal Process, Thermal Processing,JIPELEC, ag2146,JetClip,JetStar, AST SHS2000, AST STEAG 2800, ssintegration, Rapid Thermal Oxide,JetFirst ,Mattson, annealsys, heatpulse ,ag 2146,Koyo Thermo Systems,AST STEAG-MATTSON 2800, STEAG-MATTSON 2900, STEAG-MATTSON 3000, heat pulse, Solaris, Eclipse ,modularpro, RLA-1000, AG Heatpulse, rapid thermal processor, Steag AST SHS2000, Solaris 75, Solaris75,STEAG Electronic Systems ,eng-sol, Annealsys, RLA-3000, Engineering Solutions ，Solaris 150, Rapid Thermal Annealer , AS-Master ,modularpro,RTO ,Modular Process Technology, Solaris150,AS-One,AS-Micro, ADDAX, JetFirst, JetLight, JetStar, MPT-600S,MPT-800S, MPT-600XP, MPT-800XP, MPT-3000, Jipelec Jetfirst 150,Jipelec Jetfirst 200, JETFIRST 100,AnnealSys AS-One, RTP-3000, ULVAC, Ulvac Technology MILA 3000 ,Rapid Thermal Annealing, ULVAC RTA-2000,ULVAC RTA-4000,ULVAC RTA-6000,ULVAC RTA-8000,ULVAC RTA-12000, EasyTube® 3000EXT, CVD Equipment Corporation, Dr. Eberl MBE-Komponenten GmbH, AO 600,Rapid Thermal Annealing System,MBE Components,MBE Systems,OCTOPLUS 300,OCTOPLUS 400,OCTOPLUS 500,OCTOPLUS 500 EBV,OCTOPLUS 600,OCTOPLUS 600 EBV,OCTOPLUS-O 400,Thin Film Systems,Organic Deposition System,Rapid Thermal Annealing,MBE Components,Thin Film / CIGS / CZTS / CdTe,ECM, Annealsys AS-Premium, Annealsys Zenith-100, Annealsys AS-One, Annealsys AS-Master, Jipelec JetStar, Annealsys AS-Micro, Jipelec JetLight, Jipelec JetFirst 100, Jipelec JetFirst 200, Jipelec JetFirst 300, CreaTec Fischer & Co. GmbH, Rapid Thermal Anneling System, Mini MBE System,Growth System, Research Linear Transfer System,RTA System,UHV Shuttle System, SemiTEq JSC, Molecular-Beam Epitaxy Systems (MBE),PVD Systems,RTP & RTA Systems,ICP/RIE/PECVD Systems,Components and accessories, STE RTP150, STE RTA100, STE ICP200 , ADVANCE RIKO, Inc., RTP-mini, Atmospheric Thermoelectric Module Evaluation System F-PEM,Mini Lamp Annealer MILA-5050,infrared lamp heating system, ULTECH CO.LTD,Real RTP-100,Real RTP-100,Real RTP-150,Real RTP-Mini,SPUTTER,DRY ETCHER,PECVD,ALD,E beam evaporator,Thermal Evaporator, SJ High Technology ,Tube RTA,R-8160,drawer type RTA, R-401, Dai-ichi Kiden Co.,Ltd., Combustion furnace,High vacuum heating system,Vertical high temperature heating system,Induction heating system(elevating),Ultra high temperature heating system, Koyo Thermo Systems Co.,Ltd., Premtek Technology Co，技鼎股份有限公司，技鼎股份有限公司，VF-5900 300mm Large Batch,VF-5700 300mm Mini Batch,VF-5300,8 inch,Large Batch,VF-5100,8 inch,Wide-Range Batch,VF-3000,8 inch,Low-Cost Mini Batch,VF-1000,Small Production and R&D,VFS-4000,Large Bore Vertical Furnace,Koyo Thermo Systems Co.,Ltd.,Model 200 Series Horizontal Furnaces for Mass Production and Experiments,Model 206A Horizontal Furnace for PV Production ,Model 206A Horizontal Furnace for PV ,Production,RLA-3100 Lamp Annealing System for Rapid Thermal Processing,RLA-1200 Lamp Annealing System for Rapid Thermal Processing,RLA-1200 Lamp Annealing System for Rapid Thermal Processing,SO2-12-F Heated-air Circulating Type Clean Oven for 300-mm Wafers,CLH Series High-Temperature Clean Ovens,CLH Series High-Temperature Clean Ovens,VFS-4000 Large Bore Vertical Furnace,VF-5300HLP Activation Annealing Furnace,VF-5300H Vertical Furnace for Gate Insulating Film Formation,VF-5300H Vertical Furnace for Gate Insulating Film Formation,RLA-4106-V Lamp Annealing System for Contact Annealing,RLA-4106-V Lamp Annealing System for Contact Annealing,VF-3000HLP Activation Annealing Furnace, VF-3000HLP Activation Annealing Furnace,VF-3000H Vertical Furnace for Gate Insulating Film Formation,VF-3000H Vertical Furnace for Gate Insulating Film Formation,RLA-3100-V Lamp Annealing System for Contact Annealing,RLA-3100-V Lamp Annealing System for Contact Annealing,Rapid temperature rise annealing furnace RTP_Table ，RTP_Table type rapid temperature rise annealing furnace，Rapid temperature rise annealing furnace RTP_SA ，RTP ，semi-automatic rapid temperature rise annealing furnace，Rapid temperature rise annealing furnace ，RTP_Auto ，automatic rapid temperature rise annealing furnace，RTP600V，RTP600Z，RTP500Z，RTP500V，RTP500SV，快速退火炉，北京东之星应用物理研究所，快速升溫退火爐，estarlabs，Glovebox+PVD,2D material CVD,LPCVD & furnace,Vacuum Sintering Furnace,RTP,Plasma Doping (PDS),ASHER,Wet bench,Crystal Si solarcell Mgage 200, Mgage 300, M-gage 200, M-gage 300,Sheet Resistant measurement, Metrology, Tencor M-Gage 300,Tencor M-Gage 200, sheet resistance, sheet resistance Measurement, Semiconductor Equipment, Semiconductor metrology Equipment, KLA-Tencor, Tencor, Sonog-age 200, Sono-gage 300, Sonogage200, Sonogage 300, Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450,Perkin-Elmer 4480, Perkin-Elmer 2400, Perkin Elmer 4400, Perkin Elmer 4410, Perkin Elmer 4450,Perkin Elmer 4480, Perkin Elmer 2400, Sputter, Magnetron Sputter, Diode Sputter, DC Sputter, RF Sputter, DC Magnetron Sputter, RF Magnetron Sputter, Co-sputter, Reactive Sputter, MRC, MRC 603, MRC 903, MRC 602, MRC 902, MRC 604, MRC 904, MRC 924, Plasma Etch, Dry Clean, Bias Function, Cathode, Load lock, Degas, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment,, Thin Film, Metal Thin Film, Thin Film Deposition, PVD, Physical Vapor Deposition Singulus,singular, pecvd,Plasma Enhanced Chemical Vapor Deposition, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment Furnace, MRL, MRL 4 Stack,Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment，Eaton Reliance 850，SOLARIS 100,SOLARIS 200,SOLARIS 150,SOLARIS 150UV,surface science integration, ssi-rtp,ecm-usa,Jipelec JetLight,Jipelec JetFirst 100,Jipelec JetFirst 200,Jipelec JetFirst 300,Jipelec JetStar,Annealsys AS-Micro,Annealsys AS-150,Annealsys AS-100,Annealsys AS-One,Annealsys AS-Master,Annealsys AS-Premium,Annealsys Zenith-100, unitemp, Vacuum Solder System , VSS-450-300 ,RTP-100,RTP-100-EP,RTP-100-HV,RTP-100-HV-EP,RTP-150,RTP-150-EP,RTP-150-HV,RTP-200,VPO-300,VPO-300-HV, hot plate HP-220,hot plate , VSS-450-300, RSO-200, RSO-300, RSS-210-S, RSS-160-S, RSS-110-S , ULVAC, Real RTP-100,Real RTP-150,Real RTP-Mini, SJ High Technology Company, ULTECH, Mattson,Helios XP, Helios C200,Millios,Aspen III,Aspen II,Alpine, Plasma Asher, Descum, Clean, Novyka, Selective Etch Systems, Surface Treatment Systems, Interface Treatment Systems, paradigmE, inductively coupled plasma, ICP, SUPREMA, plasma dry strip , Dry Strip, Plasma ETCH,Plasma ETCH,Surface Treatment ,Ultra-Selective Materials Removal, Rapid Thermal Processing, Millisecond Anneal, Steag-AST RTA,Steag,Mattson-Steag, STEAG 100CS,STEAG Electronic Systems,rapid thermal processing , clean process, CVD ,post-CMP-cleaning,AST 3000,STEAMpulse, high-temperature thin and thick oxides, post-dielectric deposition anneals, selective oxidation , low-temperature copper anneals,Poseidon Double Tank Tool, DTT, ritical cleaning , pre-gate oxidation, pre-epi, pre-furnace,RTP, STEAG AST Elektronik,STEAG / MATTSON / AST 100,STEAG / MATTSON / AST 2800,STEAG / MATTSON / AST 2800E, ,STEAG / MATTSON / AST 2900,Spare Parts, STEAG / MATTSON / AST 3000, STEAG / MATTSON / AST 3000 plus,STEAG / MATTSON / AST Atoms, STEAG / MATTSON / AST Helios, STEAG / MATTSON / AST Helios 6000,STEAG / MATTSON / AST SHS 10MA,STEAG / MATTSON / AST SHS 10MA, STEAG / MATTSON / AST SHS 2000,STEAG / MATTSON / AST SHS 2800, STEAG / MATTSON / AST,STEAG / MATTSON / AST SHS 2800E, STEAG / MATTSON / AST SHS 3000,AST Steag Mattson SHS 1000VAC, RTP, Rapid Thermal Processor,JTEKT Thermo Systems,Crystec Technology,RTP/RTA system RLA 1200, RTP/RTA system RLA 3100, RTP/RTA system RLA 3300, Unity 2900, 0.18-micron thermal processing system, Zhengzhou KJ Technology,High Vacuum RTP-Rapid Annealing Furnace,RTP infrared tube heating tube furnace,RTP rapid annealing furnace,Custom RTP tube furnace,1200℃ RTP Annealing Tube Furnace with Slide-able Quartz Tube,Touch screen RTP rapid annealing furnace,900℃ Two Zone IR-Heating RTP Tube Furnace,900℃ RTP tube furnace with multi-channel proton flowmeter control system,1200℃ Crucible Movable Tube Furnace,Compact Atmosphere Controlled RTP Furnace with 4＂ ID Quartz Tube up to 1100ºC,900℃ Max Slideable RTP Tube Furnace,MATTSON AST Steag 2800,MATTSON AST Steag 2900,MATTSON AST Steag 3000,Steag RTP Systems, Steag Heatpulse 610,Applied Materials,Centura DPN HD,Producer Pyra Anneal,Vantage Astra DSA,Vantage RadOx RTP,Vantage Radiance Plus RTP,Steam oxidation,Applied Materials Centura RTP,Producer Pyra Anneal,radical oxidation,millisecond annealing,model-based controller,Vantage Vulcan RTP,SEMATECH Methodologies , 0.25 m Technology Thermal Applications,firstnano,EasyTube 2000,EasyTube 3000,EasyTube 3000EXT,EasyTube 101,EasyTube 6000, EasyTube 6308, Applied Materials Vantage RadiancePlus, AMAT Vantage RadiancePlus,Vantage RadiancePlus, 0.25 pm TECHNOLOGY,Lamp-based,Laser-based,Heater-based,irradiate the surface of the material,Veeco,Mattson Technology,Screen Holdings,AnnealSys,Applied Materials,Kokusai Electric,JTEKT Thermo Systems,Tokyo Electron,Centrotherm,Hitachi Kokusai Electric,Modular Process Technology,Shankar Muthukrishnan,Beyond the 100nm node, single-wafer RTP,single-wafer rapid thermal Processing, sub-100nm device design node,ultra-shallow junction activation and anneal,USJ, silicide contact formation, thermal oxidation STI formation, spike anneal ,spike annealing, within-wafer uniformity, wafer-to-wafer process uniformity, nickel silicide formation,radical-based oxidation process,rapid thermal processing spike anneal,300mm RTP spike anneal process,ramp-up methodologies, rampdown methodologies,Rapid thermal annealing apparatus,RTA furnace,Dai-ichi Kiden,Dai-ichi Kiden RSA, Combustion furnace, High vacuum heating system, Vertical high temperature heating system,Induction heating system(elevating),Ultra high temperature heating system,CreaTec Fischer,Growth Systems,Mini MBE System,LT-STM/AFM,Evaporators,Centrotherm,centrotherm c.HORICOO 300 ,horizontal batch-type system,centrotherm c.HORICOO 200 , field-proven , ultra-versatile tube furnace system ,centrotherm c.VERTICOO , batch-type wafer processing , semiconductor device fabrication, atmospheric processes, LPCVD processes,centrotherm c.ACTIVATOR, high-temperature annealing, high-volume SiC device manufacturing, electrical activation , post implantation annealing ,SiC MOSFET , diode manufacturing,Cost-efficient dopant activation,Annealing of AlN seed layers , Annealing of AlN epitaxial layers,centrotherm c.OXIDATOR , high-temperature oxidation furnace , Rapid Thermal Processing system for silicon and compound semiconductors,c.RAPID 200,fully automatic loading system,centrotherm PECVD,c.PLASMA, c.DIFF,centrotherm highly versatile diffusion,wide band gap,c.CRYSCOO HTA,AP Systems,AP Systems Korea,KORONA RTP-12MP, KORONA RTP-12LPO , KORONA RTP-12LR/LPRR,Seebeck Coefficient / Electric Resistance Measurement System ZEM-3 series，Mini Lamp Annealer MILA-5050， Atmospheric Thermoelectric Module Evaluation System F-PEM，

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