Conduct Thin Film Metrology Selection and Configuration

Please provide the following requirements and planning information. Based on your application requirements, Allwin21 will recommend a suitable metrology model and configuration.

Contact Information

1. Your Name(Required):

2. Your Email(Required):

3. Your Company Name(Required):

4. Company Address:

5. Substrate Maximum Size(Required):
Small Sample1 inch2 inch3 inch4 inch5 inch6 inch8 inchOthersNot sure
6. Substrate Material(Required):
SiSiCGaAsGaNGaInPInPOthersNot sure
7. Measurement Parameters(Required):
Sheet ResistanceFilm ThicknessOthersNot sure
8. Thin Film Materials(Required):
Epi-SemiconductorAlAuWTaNxCuOthersNot sure
9. Substrate Resistivity(Ω.cm,Required):
<0.050.05-11-100100-100K>100kOthersNot sure
10. Thin Film resistivity(mΩ.cm,Required):
<0.0010.001-11-100100-100K>100kOthersNot sure
11. Multi-Layer Substrate? Specify if Yes(Required) :

12. Data Output(Required):
File of ComputerPrinterOthersNot sure
13. Environment Temperature (Required) :
Under ControlledRoom Temperature (No Control)OthersNot sure
14. Parameter Range: Film Sheet resistance(Ω/□ , Required):
0.001-11-2000OthersNot sure
15. Parameter Range: Film thickness (Angstroms, Required):
<100100- 200k>200kOthersNot sure
16. Did you use any Thin Film Sheet Resistance Measurement Instrument which met your requirements? If yes, pls specify brand and model.

17. Approximate budget(Required):
< USD$ 5K< USD$ 10K< USD$ 15K< USD$ 20K< USD$ 25K< USD$ 30K< USD$ 50K< USD$ 60K< USD$ 70K< USD$ 80K> USD$ 80KNot sureOthers

18. Approximate purchasing time (Required):
<In 1 monthIn 2 monthsIn 3 monthsIn 6 monthsIn 9 monthsIn 12 monthsIn 24 monthsNot sureOthers

19. Throughput Requirement :
<R&D only<10 wafers per day<20 wafers per day<30 wafers per day<40 wafers per day<50 wafers per day<100 wafers per day<200 wafers per day<500 wafers per day>500 wafers per dayNot sureOthers

20. Special Requirements:

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