Upper Chamber Assembly, Tegal 90X

Part Number:         TBD

Description:         Upper Chamber Assembly, Tegal 90X

SKU: Upper Chamber Assembly Tegal 90Xe Category: Tag:

Product Description

Part Number:         TBD

Description:         Upper Chamber Assembly, Tegal 90X

Item

P/N

Description

Qty

1

39-342-001

CHMBR TOP 9XX

1

2

80-195-119

FTNG VCR 9/16-18M 7/16-20M SST

2

3

80-202-394

O-R,CHEMRAZ,3/4IDX1/8W,D80

1

4

80-202-468

O-R,CHEMRAZ,10 1/2IDX3/16W,D80

3

5

39-343-001

MANF CHMBR 9XX

1

6

80-202-467

O-R,CHEMRAZ,7 1/4IDX1/8W,D80

1

7

39-344-010

ELCTD UPR cooling plate 903E

1

8

80-192-200

FTNG STR 1/4ID T-1/8MNPT BRB P

2

9

37-221-001

ELCTD UPR T/903E

1

10

39-341-005

CHMBR BODY VENTED 903E

1

11

80-202-465

O-R CHEMRAZ 1/4ID 3/32W D80

2

12

40-159-001

ROD SAPPHIRE .25DIA STRAIGHT

2

13

39-819-001

BLOCK FIBER OPTIC 9XX

2

14

39-818-001

SLEEVE FIBER OPTIC 9XX

2

15

80-202-212

O-R VITON 5/16ID 1/8W D70

1

16

40-140-003

RING INSUL CER 99.5 9XX

1

17

41-399-001

GROUND RING

1

18

37-568-001

CLAMP,INSULATOR RING 900

1

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Allwin21 Corp. has been focusing on providing solutions and enhancements to Tegal 901eTegal 903eTegal 901e TTWTegal 903e TTW used plasma Etch RIE semiconductor process equipment. These OEM Etch RIE semiconductor equipment have been used in productions and R&D since 1990′s. They have been proven to be a true “work horse”. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC, solid robotic wafer transfer system and new critical components to achieve the goal of giving our customers a production edge with right cost.

Tegal 901e Plasma Etch RIE

Manufacturer:Tegal | Condition:Fully Refurbished&Upgraded By Allwin21 | Wafer Size:3″/4″/5″/6″Capability |  Wafer loading: Automatic, Original Belt-Shuttle-Wafer-Transfer OR Allwin21 Solid-Robotic-Wafer-Transfer | Plasma Power:RF,13.56MHz | Type:Parallel/Single Wafer Process/Plasma Etch/RIE/Stand Alone | Etch Materials: Polysilicon, Refractory metal silicides and Nitride | Gas Lines:1~4 lines capability with customized MFCs range

Tegal 903e Plasma Etch RIE

Manufacturer: Tegal | Condition: Fully Refurbished&Upgraded By Allwin21 | Wafer Size: 3″/4″/5″/6″Capability |  Wafer loading: Automatic, Original Belt-Shuttle-Wafer-Transfer OR Allwin21 Solid-Robotic-Wafer-Transfer | Plasma Power: RF,13.56MHz | Type: Parallel/Single Wafer Process/Plasma Etch/RIE/Stand Alone | Etch Materials: Silicon Oxide | Gas Lines: 1~4 lines capability with customized MFCs range

Tegal 901e TTW Plasma Etch RIE

Manufacturer:Tegal | Condition:Fully Refurbished&Upgraded By Allwin21 | Wafer Size:3″/4″/5″/6″Capability |  Wafer loading: Automatic, Allwin21 Solid-Robotic-Wafer-Transfer | Plasma Power: RF,13.56MHz | Type:Parallel/Single Wafer Process/Plasma Etch/RIE/Through-The-Wall(TTW) | Etch Materials: Polysilicon, Refractory metal silicides and Nitride | Gas Lines:1~4 lines capability with customized MFCs range

Tegal 903e TTW Plasma Etch RIE

Manufacturer: Tegal | Condition: Fully Refurbished&Upgraded By Allwin21 | Wafer Size: 3″/4″/5″/6″Capability |  Wafer loading: Automatic, Allwin21 Solid-Robotic-Wafer-Transfer | Plasma Power: RF,13.56MHz | Type: Parallel/Single Wafer Process/Plasma Etch/RIE/Through-The-Wall(TTW) | Etch Materials: Silicon Oxide | Gas Lines: 1~4 lines capability with customized MFCs range

Upgrade Kits for Tegal 901e Tegal 903e

The Upgrade kit for Tegal® 901e Tegal® 903e includes an advanced AW-900 System Control with touch screen operator interface or 17″ LCD Monitor , New PC with Allwin21 AW-900 software and new main control board.