RFQ – Plasma Etch RIE Systems

    Please help fill in the following Customer Survey Form for suitable Plasma Etch RIE equipment model and configuration for your applications.Appreciate your time. Thank you very much.

    1. Your Name(Required):

    2. Your Email(Required):

    3. Your Company Name(Required):

    4. Company Address:

    5. Substrate Sizes(Required):
    small sample1 inch2 inch3 inch4 inch5 inch6 inch6.125 inch6.25 inch8 inch12 inchOthers
    6. Substrate Material(Required):
    SiSiCGaAsGaNGaInPInPOthersNot sure
    7. Etch Material (Required):
    NitrideSilicon DioxidePolysiliconRefractory metal silicidesBarrier-metal/alloysMetal lead(Al,Al-Alloy with silicon)OthersNot sure
    8. What are the highest and lowest process temperature(Required,°C):

    9. What is the Etcher rate specification:

    10. What are the Etcher Uniformity/Repeatability specifications:

    11. Amount of Gas lines(Required):

    12. What are the maximum and minimum RF power watts?

    13. Did you use any Plasma Etcher RIE Equipment which met your requirements? If yes, pls specify brand and model(Required).

    14. Do you know Tegal , Matrix , Lam Research ,Gasonics plasma etcher RIE equipment?If yes, pls tell us which model you know.

    15. Approximate budget(Required):
    < USD$ 50K< USD$ 100K< USD$ 120K< USD$ 150K< USD$ 200K< USD$ 250K< USD$ 350K< USD$ 450K< USD$ 550K< USD$ 800KNot sureOthers

    16. Approximate purchasing time (Required):
    <In 1 monthIn 2 monthsIn 3 monthsIn 6 monthsIn 9 monthsIn 12 monthsIn 24 monthsNot sureOthers

    17. Throughput Requirement :
    <R&D only<10 wafers per day<20 wafers per day<30 wafers per day<40 wafers per day<50 wafers per day<100 wafers per day<200 wafers per day<500 wafers per day>500 wafers per dayNot sureOthers

    18. Special Requirements:

    Include Files(Limit:3M File types:PDF|JPG|JEPG):
    Files1 :
    Files2 :
    Files3 :
    Files4 :
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