Perkin-Elmer 4400-Series System -Production Sputtering Systems are manufactured in three (3) specific configurations, as follows:
A manually-loaded system capable of limited automatic operation, but requiring manual selection of target and sputtering mode. The Model 4400 sputtering head is equipped with four (4) 8″ round cathode positions, one (1) of which may be fitted with an in-process heater fixture in place of a target (Mo shields, vane shutter, and full circle shutter.)
A manually-loaded system cap,able of fully automatic operation. The Model 4450 sputtering head is equipped with three (3) Delta™ cathode positions, one (1) of which
may be fitted with an in-process heater fixture in place of a target. Using optional adaptors, the cathode apertures can also accept 8″ round targets. (Mo flame sprayed shields and shutters standard; W-C flame sprayed shields and shutters-optional.)
A cassette-to-cassette automatic wafer loading system capable of fully automatic operation.Capacity per pallet(in automatic wafer handling mode):
Size of wafers | Qty. per pallet |
3″ | 16 |
4″ | 12 |
5″ | 8 |
6″ | 7 |
The Model 4480 sputtering head is equipped with three (3) Delta™ cathode positions, one (1) of which may be fitted with an in-process heater fixture in place of a target. Using optional adaptors, the cathode apertures can also accept 8″ round targets. (Mo flame sprayed shields and shutters standard; W-C flame sprayed shields and shutters optional.)
The Perkin-Elmer 4400-Series System- Production Sputtering Systems deposit a wide variety of materials onto substrates such as ceramics, metals, plastics,glass and semiconductors. The systems also can be used for RF sputter-etching, a process in which material is removed from, rather than being deposited on, the substrates prior to sputter deposition.
These Perkin-Elmer 4400-Series System – sputtering systems sequentially deposit thin films of up to three different materials onto a single substrate, thus attaining sandwich-structured films such as multi-layer optical interference filters or semiconductor devices. Resulting thin films range in thickness from a few Angstroms up to several microns.
For improved throughput and added convenience, the high-capacity load lock permits substrate wafer loading without breaking vacuum in the process chamber. A New Allwin21 PC System Controller provides complete automation of sputtering operations on Models 4450 and 4480 (target and mode selection are NOT automated on the Model 4400).
Allwin21 Corp. has been focusing on providing solutions and enhancements to Perkin-Elmer 4400,Perkin-Elmer 4410, Perkin-Elmer 4450, Perkin-Elmer 4480 used sputter deposition semiconductor process equipment. These OEM semiconductor equipment have been used in productions and R&D since 1990′s. They have been proven to be a true “work horse”. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC and new critical components. We rebuild AccuSputter AW 4450 Series Sputter Deposition systems with our own integrated process control system, giving our customers the tools to achieve a production edge at very low cost impact.