The Gasonics Aura 1000 Plasma Asher System is a microprocessor controlled down-stream, or “afterglow” photoresist stripper that will strip the front and backs~de of a wafer, typically in less than one minute. The unit is fully automated, cassette-to-cassette, and is a single-wafer process design.
The Gasonics Aura 1000 Plasma Asher consists of two separate but interconnected ‘vacuum -chambers (reaction and stripping), -a microwave plasma generator, automatic wafer loader/unloader, keypad panel/display, mass flow controllers (MFC’ s), an infrared heat source, pneumatic and electronic control systems, ‘stainless steel – gas plumbing, and incorporates several safety interlock features, as well as troubleshoo~gindicators – (LED’s) that illuminate to display the operating sequence and key component function signals.
The Gasonics Aura 1000 Plasma Asher is housed in one of three basic configurations:
1. A functional, convenient table-top cabinet;
2. Through-the-wall
3. Stand-alone mounting table.
The Gasonics Aura 1000 Plasma Asher Stripper System generates a plasma of oxygen and/or other gasses in a reaction chamber. This concentrated reactive mixture then flows downstream, reaching a state of electrical neutrality, and although highly reactive, it is no longer electrically damaging to the wafer. The mixture then enters the process chamber, where the dissociated oxygen-reacts-with the photoresist and oxidizes or “burns” the photoresist from the wafer. The main components of the Aura plasma reaction is atomic oxygen (normal oxygen consists of two atoms, while atomic oxygen consists of only one. In addition, an infrared heat source is included for difficult or temperature sensitive processes.
A typical plasma wafer stripping process is as follows:
A. The wafer is loaded from a cassette into the process chamber, which is sealed and evacuated, and heat lamps are energized to elevate the wafer temperature.
B. Regulated process gasses are precisely released into the reaction chamber.
C. The microwave generator is enabled, creating the plasma in the reaction chamber and initiating the downstream stripping action in the process chamber.
D. When end-point detection is reached and overstrip is achieved, the microwave generator and process gasses are turned off to stop the stripping action, the process chamber is purged with N2 to ambient temperature, and the stripped wafer is removed from the chamber and placed in another cassette.
Gasonics Aura 1000 Plasma Asher System Features
- Single wafer processing
- One-to-four process gas MFC’s
- 3″, 4″, 5″, and 6″ wafer capability
- Throughput: 60 wph, depending on process parameters.
- 3 Configurations: Table-top, Through-the-Wall,or with a stand-alone mounting table.
- Programmable microprocessor
- Automatic wafer loader/unloader
- Infrared heat source for process temperature control.
- Downstream processing: No wafer radiation damage.
- Soft-start vacuum system.
- Quartz or Ceramic plasma chamber.
- Equipped with hard-wired safety interlocks to prevent damage to the system or injury to either the product or to personnel.
- Front and backside resist removal
- Automatic photo emission type end-point detection
- In-line cassette-to-cassette.
- Compact: 36″ X 32″X27″ (Table Top).
- Visual alarm (flashing indicator) annunciates any illegal operation or program error.
Manufacturer: Gasonics
Condition: Fully Refurbished and Upgraded by Allwin21
Wafer Size: 3″/4″/5″/6″Capability
Wafer loading: Automatic, Solid Robotic Wafer Transfer-Allwin21 Own Technology
Plasma Power: Microwave
Type: Parallel/Single Wafer Process,Stand Alone
Gas Lines: 1 ~ 3 lines capability with customized MFCs range
All our Gasonics Aura 1000 go through a series of rigorous tests which are documented, standardized, and certified by performance and reliability standards. By strictly following these procedures, the customer receives guaranteed rapid start-up, lifecycle reliability, and proven process performance.
The Gasonics Aura 1000 single-wafer photoresist asher is an automated tool designed as a flexible downstream plasma photoresist removal system for high-volume wafer fabrication. The Aura 1000 is in direct response to manufacturer’s concerns for wafer sensitivity to processing damage, reliability, and low cost of ownership.
Gasonics Aura 1000 Features:
■ Lowest cost of ownership asher, > 95% uptime, > 320 systems in production
■ High throughput
■ Very small footprint: 32”w, 32”d 64”h
■ Front and backside isotropic removal
■ Downstream ashing for minimized device damage
■ 75mm-150mm wafer capability
■ Solid robotic wafer transfer instead of Pick and place wafer handling
■ Precise downstream endpoint detection
■ Up to 4 MFC’s
■ Pressure control, option
■ Closed loop temperature control with RTP technology
■ Touch screen
■ SECS II interface, multiple process step capability
■ Three 1KW lamps heating withClosed loop temperature control with RTP technology for precise temperature control
■ Floor/through the wall designs
Gasonics Aura 1000 Product Specifications
Gasonics Aura 1000 Process
Pressure: 1.75 to 2.5 Torr
Microwave: 1000 watts
Gas Flow: O2 4.5 SLPM
Gas Flow: N2 0.45 SLPM
Lamp Time (variable) :0-18 sec.
Temperature (variable) :150-300∞C (typical)
Closed loop temp control
Gasonics Aura 1000 Results
Ash Rates: 2μ-5μ/min. positive photoresist >8μ/min. negative photoresist
Uniformity: <20%
Selectivity to Underlying Films: >1000:1
Throughput : Up to 90 wph
Particle Control: <0.05 p/cm2 0.3μ
Damage Control :<0.IV CV-shift for 250Å gate oxide
Reliability Availability: . >95% uptime
MTBF: >100 hours
Gasonics Aura 1000 Utilities
Vacuum (pumps) 165 cfm
Cabinet Exhaust >250 cfm
Process Gases 2(4) MFC’s
Electrical Requirements 208V, 3 phase, 60 Hz 30A
Weight 350 lbs.
